Letter to the editor: DSPs for IP (Shaul Berger)
I received a plethora of e-mails regarding my recent article, entitled "Semi IP sector is a lost cause"
Then, I asked for the IP vendors themselves to respond to a set of questions. Here's one letter to the editor:
Editor,
We met in the past and I am (at least I claim to be objective) on this topic, being there and have done it several times. I think you are right on the money and it is not pleasant for companies trying to make money selling IP, to face the reality. The reality is that even many of the top 10 vendors hardly make money and by financial standards (EPS) they are not investor quality grade. I am not expert on the whole IP space but I know very well the DSP IP domain.
E-mail This Article | Printer-Friendly Page |
Related News
- Letter to the editor: Darwin's theory on IP (Kalar Rajendiran, eSilicon)
- Letter to the editor: MIPS talks IP
- Letter to the editor: IP, cars share common ground (C. Paul Slaby, Kaben Wireless Silicon)
- Letter to the editor: IP worth its weight (Jim Gobes, CEO, Intrinsix)
- Letter to the editor: Turley speaks out (Patriot Scientific)
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards