Xilinx Leads Teams with EDA Leaders to Tackle Ultra High-Capacity FPGA Design Verification
SAN JOSE, Calif. -- Aug. 14, 2007 -- Xilinx, Inc. the world's leading supplier of programmable solutions, today announced a collaboration with the industry's leading EDA companies to address the challenges of ultra-high capacity FPGA design verification. Xilinx engineers will be joined by Cadence Design Systems, Inc., Mentor Graphics Corporation, and Synopsys, Inc. to define and implement new verification flows to maximize productivity and quality of results for ultra high-density designs targeting today's 65nm FPGAs as well as new and emerging FPGA architectures. The collaboration will focus on expanding coverage, improving simulation runtime, and reducing verification time in an environment that allows designers to achieve aggressive design goals. Major releases of these tools and methodologies are expected in the first half of 2008.
"With the growing complexity of today's 65nm FPGAs, verification has become a major time consuming portion of the FPGA design flow," said Bruce Talley, vice president of the Design Software Division at Xilinx. "By collaborating with the industry's leading EDA providers, we can develop solutions to address the challenges faced by our customers at 65nm and beyond."
Xilinx introduced the industry's first 65nm FPGAs. Shipping since May of 2006, the Virtex(TM)-5 FPGA platform includes devices with up to 330,000 logic cells, 10 Mb on-chip memory, 1,200 I/Os and a host of additional hardened intellectual property (IP) blocks. Ongoing growth trends in FPGA architecture present escalating challenges for logic designers with increasing density points and capabilities across a wide range of application domains. The companies will work together to build upon existing technologies to develop next-generation verification solutions, enabling system designers to streamline the verification process.
"Joining with Xilinx in this effort helps ensure we are creating verification technology needed for today's complex devices," said Mitch Weaver, corporate vice president and general manager for Advanced Verification Systems at Cadence Design Systems, Inc. "Leveraging Cadence's proven leadership in simulation and functional verification, we can bring proven technology and methods to the ultra-high capacity FPGA user community."
"Today, FPGA verification flows rival advanced verification flows for complex ASICs and SoCs," said Robert Hum, vice president and general manager of Mentor Graphics Design Verification and Test division. "A focused effort on verification will bring the latest technology such as assertions, transaction- level modeling, clock domain crossing, formal verification and others to the FPGA designer."
"Synopsys is committed to delivering verification solutions that provide high performance and quality of results," said Manoj Gandhi, senior vice president and general manager, Verification Group, Synopsys. "By participating in the ultra high-capacity verification collaboration with Xilinx, we are able to align our efforts to bring innovations to market quickly for our mutual customers."
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Rapid Silicon Leads the Way with First Complete Open-Source FPGA EDA Tool-Chain
- Blue Pearl Software Streamlines RTL Verification for Xilinx All Programmable FPGAs and SoCs
- Chevin Technology releases 25G Ultra Low Latency MAC/PCS for Xilinx Virtex UltraScale FPGAs
- Altera Accelerates High-capacity FPGA Design with Quartus Prime Pro Design Software
- Aldec Announces HES-7, the Largest Off-The-Shelf Xilinx Virtex-7 FPGA Prototyping System at up to 288 Million ASIC Gates Capacity
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |