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Microsoft Embraces TSMC 90nm Embedded DRAM Process for Xbox 360
Production of 90nm Microsoft Graphics-Memory Subsystem Underway
HSINCHU, Taiwan, Aug. 15, 2007 -- Taiwan Semiconductor Manufacturing Company, Ltd. today announced that Microsoft has started production of the Microsoft Xbox 360 graphics-memory subsystem using the TSMC 90nm embedded DRAM process. Designed to meet the needs of volume consumer electronics devices, the TSMC 90nm eDRAM process features a high-density macro design (80Mb) and fast performance to 500MHz.
"Microsoft's selection of the TSMC 90nm eDRAM process for the graphics-rich Xbox 360 is an important validation of the capability and maturity of the technology," said John Wei, senior director of Platform Marketing, Advanced Technology Division of TSMC. "Furthermore, the production marks the successful continuation to an ongoing collaboration between Microsoft and TSMC."
"TSMC provides the proven manufacturing and chip implementation services required to build a competitive silicon component in volume," said Bill Adamec, senior director of Semiconductor Technology of Microsoft. "The TSMC 90nm eDRAM process is exactly what we need to further strengthen our position in console gaming and entertainment."
TSMC has been in 90nm embedded DRAM production since the first quarter of 2006, and the design team has developed versatile sets of memory macros that are being used in more than a dozen 90nm customer products.
About TSMC 90nm eDRAM
The TSMC 90nm embedded DRAM process is a CMOS logic process with an add-on memory module. The embedded process eliminates I/O power consumed in external DRAM interfaces, while providing a wider bus and BOM cost savings compared to external DRAM. This makes TSMC 90nm eDRAM ideal for system-on-chip (SoC) platforms used in high-bandwidth applications such as digital TV or game consoles, as well as low-power applications such as handheld and miniature consumer electronics. Less than half the size of an embedded SRAM macro, TSMC 90nm eDRAM consumes less power in both active and standby modes. Embedded memory also saves board space, enhances system reliability and reduces the soft error rate. Memory options are flexible to 1Mb of granularity.
About Xbox 360
Xbox 360 is the most powerful video game and entertainment system, delivering the best games, the next generation of the premier Xbox Live online gaming network and unique digital entertainment experiences that revolve around gamers. Xbox 360 has a catalog of more than 160 high-definition games and is available in 37 countries. More information can be found online at http://www.xbox.com/xbox360.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total installed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, and one six-inch fab. TSMC also has substantial capacity commitments at its wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
HSINCHU, Taiwan, Aug. 15, 2007 -- Taiwan Semiconductor Manufacturing Company, Ltd. today announced that Microsoft has started production of the Microsoft Xbox 360 graphics-memory subsystem using the TSMC 90nm embedded DRAM process. Designed to meet the needs of volume consumer electronics devices, the TSMC 90nm eDRAM process features a high-density macro design (80Mb) and fast performance to 500MHz.
"Microsoft's selection of the TSMC 90nm eDRAM process for the graphics-rich Xbox 360 is an important validation of the capability and maturity of the technology," said John Wei, senior director of Platform Marketing, Advanced Technology Division of TSMC. "Furthermore, the production marks the successful continuation to an ongoing collaboration between Microsoft and TSMC."
"TSMC provides the proven manufacturing and chip implementation services required to build a competitive silicon component in volume," said Bill Adamec, senior director of Semiconductor Technology of Microsoft. "The TSMC 90nm eDRAM process is exactly what we need to further strengthen our position in console gaming and entertainment."
TSMC has been in 90nm embedded DRAM production since the first quarter of 2006, and the design team has developed versatile sets of memory macros that are being used in more than a dozen 90nm customer products.
About TSMC 90nm eDRAM
The TSMC 90nm embedded DRAM process is a CMOS logic process with an add-on memory module. The embedded process eliminates I/O power consumed in external DRAM interfaces, while providing a wider bus and BOM cost savings compared to external DRAM. This makes TSMC 90nm eDRAM ideal for system-on-chip (SoC) platforms used in high-bandwidth applications such as digital TV or game consoles, as well as low-power applications such as handheld and miniature consumer electronics. Less than half the size of an embedded SRAM macro, TSMC 90nm eDRAM consumes less power in both active and standby modes. Embedded memory also saves board space, enhances system reliability and reduces the soft error rate. Memory options are flexible to 1Mb of granularity.
About Xbox 360
Xbox 360 is the most powerful video game and entertainment system, delivering the best games, the next generation of the premier Xbox Live online gaming network and unique digital entertainment experiences that revolve around gamers. Xbox 360 has a catalog of more than 160 high-definition games and is available in 37 countries. More information can be found online at http://www.xbox.com/xbox360.
About TSMC
TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total installed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, and one six-inch fab. TSMC also has substantial capacity commitments at its wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
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