SiBEAM, Inc. Selects Tensilica Configurable Processor for Baseband DSP in Wireless Link for HDTV Devices

Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)

SANTA CLARA, CA - August 20, 2007 -- Tensilica, Inc. today announced that SiBEAM, Inc., a leading innovator of millimeter wave (mmWave) solutions and developer of high-speed wireless communications platforms, has selected Tensilica’s Xtensa configurable processor for an upcoming chip design project.

“SiBEAM has developed its wireless communications products to deliver high quality wireless video solutions for consumer electronics and display applications. These applications demand high data rate transmission to multiple devices within an indoor wireless environment using conventional CMOS silicon,” said Kumar Mahesh, manager of MAC and Software Design for SiBEAM, Inc. “We selected Tensilica’s Xtensa processor for its ability to help us achieve our goal of developing innovative-multi-gigabit, lower-power mmWave communications products. By optimizing the Xtensa processor into a tailored processor core, this enables our products to attain the performance these wireless applications demand.”

“SiBEAM has successfully pushed the limits of wireless technology and made significant breakthroughs never before realized in the 60GHz frequency band,” stated Steve Roddy, Tensilica’s vice president of marketing. “Our Xtensa DSP processor assists SiBEAM in making multi-gigabit wireless a reality by providing customization options for superior performance.”

Designers can mold Tensilica’s Xtensa processors to fit demanding applications. They are offered a menu of checkbox and drop-down menu options so they can pick just the features they need. Additionally, designers can add multi-cycle execution units, registers, register files and much more to optimize instructions for the application. All of the tools, including the compiler and debugger, are automatically updated to match the changes made by the designer.

About SiBEAM, Inc.

Founded in 2004, SiBEAM is a fabless semiconductor company developing intelligent millimeter wave technologies and leveraging the latest manufacturing methods to meet the demand for high-bandwidth services. SiBEAM is the first to build 60 GHz chipsets using CMOS technology. SiBEAM is a founding member of the WirelessHD™ special interest group and intends to support delivery of the first uncompressed wireless high-definition digital interface for A/V networks, the first of many applications for SiBEAM’s innovative technology. For more information, please visit: www.sibeam.com.

About Tensilica

Tensilica, Inc. is the recognized leader in configurable processor technology and has leveraged that technology to become the leading supplier of licensable controllers and DSP cores for mobile audio and video applications. Tensilica offers the broadest line of controller, CPU, network, and specialty DSP processors in the market today – including full software tool-chain and modeling support - in both, an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. The modern design behind all of Tensilica’s processor cores provides semiconductor companies and system OEMs with the lowest power, smallest area solutions for high-volume products including mobile phones and other consumer electronics, networking and telecommunications equipment, and computer peripherals. For more information on Tensilica’s patented, benchmark-proven processors,, visit www.tensilica.com