S3 Delivers Another Industry First at 65nm - High Performance Mixed Signal Converter IP
S3's IP Targets Consumer, Wireless, Network and Digital Broadcast Applications
Santa Clara, California - September 11, 2007 - Silicon & Software Systems (S3), a world leading supplier of licensable mixed-signal intellectual property (IP), today announced the immediate availability of silicon results for its portfolio of high-performance, mixed-signal converter IP at the 65nm technology node. S3 is already delivering this IP to 2 of the top 10 global semiconductor companies.
The company will be presenting these new IP cores at the 2007 FSA Supplier’s Expo being held at the Santa Clara Convention Center on September 12th. S3’s extensive IP portfolio includes AFEs, ADCs, DACs and associated PLL components, optimized for integration into system ICs targeting consumer, wireless, network and digital broadcast applications. End markets served by existing S3 clients include WLAN, WiMAX, digital broadcast standards (e.g. DVB-T, DVB-S, DVB-C and DVB-H), High-Definition (HD) video applications and power-line communications.
“We have a deliberate strategy to address the needs of the high growth consumer applications market by broadening our IP portfolio at the 90nm, 65nm and lower technology nodes,” said Mike Murray, S3 General Manager, Mixed Signal IP. “S3's first time success in migrating this high performance mixed signal converter IP portfolio to the 65nm node marks another industry first for S3 at this node.”
S3 is taping out solutions, integrating IP into single-chip systems, leveraging extensive design experience, and producing more than 35 SoC designs at the 90nm and 65nm process technology nodes. A major attraction for customers is access to S3's SoC integration engineering expertise in combination with silicon-proven IP. The advantage of a one-stop-shop for IP and design services at the 65nm node translates into clients having confidence that their product will meet exact market windows. S3 will discuss mixed-signal IP at advanced technology nodes, design services and the advantages of incorporating mixed-signal IP blocks into single-chip systems at the September 12th FSA Supplier Expo. S3 will be located at Booth #206 at the Santa Clara Convention Center.
|
Related News
- NXP and Virage Logic Strategic Alliance Accelerates NXP's Move to High Performance Mixed Signal Leadership and Further Establishes Virage Logic as an IP Power House
- S3 Mixed Signal IP Portfolio Tapes Out at 65nm
- Key ASIC Launches ASIC & SoC Design-to-Manufacture Services for Communications and Consumer Electronics Applications; Company Specializes in High Performance, Low Power Mixed-Signal and Digital Design
- Xilinx Delivers Breakthrough Design Tool For High Performance Signal Processing With New System Generator For DSP v6.3I
- AST & Science Selects Omni Design to Provide High Performance Data Converter Solutions for its Cellular Broadband Network
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |