Ceva-Waves Bluetooth 5.3 Low Energy Baseband Controller, software and profiles
National extends foundry pact with Tower for two years
National extends foundry pact with Tower for two years
By Semiconductor Business News
April 27, 2000 (4:05 p.m. EST)
URL: http://www.eetimes.com/story/OEG20000427S0037
MIGDAL HAEMEK, Israel--Tower Semiconductor Ltd. here today announced it has extended a silicon foundry agreement with National Semiconductor Corp. for two years and will provide the U.S. chip company with core CMOS and nonvolatile memory technologies. U.S. sales director Doron Simon at Tower said the agreement "demonstrates a vote of confidence" in the Israeli foundry company. In recent years, Tower has been struggling with losses, but the Israeli foundry supplier hopes to turn around its business in 2000. A new technology agreement with Toshiba Corp. of Japan has been struck by Tower several weeks ago in an attempt to gain advanced CMOS logic technology needed for a long-planned second wafer fab (see April 3 story).
Related News
- Urgent Orders Boost Wafer Foundry Utilization in Q2; Global Top 10 Foundry Revenue Grows 9.6% while VIS Climbs Two Spots, Says TrendForce
- RISC-V International Achieves Milestone with Ratification of 40 Specifications in Two Years
- Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
- Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement
- Siemens extends support for Samsung Foundry's latest process technologies
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
E-mail This Article | Printer-Friendly Page |