STMicroelectronics Introduces Next-Generation Secure MCUs Based on 0.13-micron Process Technology
Cost-efficient solution for banking applications integrates latest security features for EMVCo certification
Geneva, September 13,2007 - STMicroelectronics, a leading supplier of smartcard ICs to the financial sector, today announced a new family of secure microcontrollers based on a 0.13-micron state-of-the-art process technology, which are intended for banking, loyalty card and other financial applications. This advanced family is based on the new ST23 secure platform, which takes advantage of the most recent improvements in security technology and offers optimized computing power for advanced secure applications.
The ST23YS02 and ST23YS08 integrate 2 and 8 Kbytes of EEPROM, respectively. Competitive pricing, aided by their 0.13-micron manufacturing process, makes them ideal for a range of finance applications, but particularly for EMV migration from magnetic stripe to SDA (Static Data Authentication) Chip and PIN cards. A simplified architecture makes them easy to use to further reduce costs for code developers.
Both MCUs embed an eDES (enhanced DES) accelerator and support AES (Advanced Encryption Services) cryptography, and are certified to meet current EMVCo requirements. They provide ISO and IART interfaces, with planned additions to the family including crypto-processor and contactless products.
“ST’s new 0.13-micron family builds on more than 20 years experience in the design and manufacture of secure products for the banking industry, and is supported by our expertise in advanced non-volatile memories,” said Marie-France Florentin, ST’s Smartcard ICs Business Director. “Incorporating the security improvements developed over the last two years, the first small-memory devices in the family offer highly cost effective solutions for SDA migration and loyalty cards.”
Samples of the ST23YS08 will be available from September 2007, with volume production planned for November; the ST23YS02 will sample in December 2007 and will be available in volume from January 2008. Both devices are supplied in wafer form or as micro-modules.
Pricing for the ST23YS08 is $0.80 in quantities of 100,000 units.
About EMVCo
EMVCo LLC was formed in February 1999 by Europay, MasterCard and Visa, to manage, maintain and enhance the EMV™ Integrated Circuit Card Specifications for Payment Systems. With the acquisition of Europay by MasterCard in 2002 and JCB International joining the organization in 2005, EMVCo is currently operated by JCB International, MasterCard International, and Visa International.
About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2006, the Company's net revenues were $9.85 billion and net earnings were $782 million. Further information on ST can be found at www.st.com.
|
Related News
- Impinj Delivers Logic Nonvolatile Memory in Tower Semiconductor's 0.13-Micron Process
- Tower Semiconductor Selects Artisan's Digital and Mixed-Signal IP Platform for 0.13-Micron Process
- New 64-Bit RISC Microprocessor from Toshiba Utilizes 0.13-Micron Process Technology to Achieve 300MHz Operating Frequency
- TSMC 0.13-Micron Copper Process Delivers Altera's Stratix Devices In Record Time
- Faraday Introduces Free High Performance Library Offerings for UMC's 0.13-Micron Logic Process
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |