Temento Systems Launches Its North American Based Operation from Northern California
SAN JOSE, Calif. & GRENOBLE, France-- September 13, 2007 --Temento Systems® SA announced today it has established a California office in San Jose, serving the North American market. Temento is a leading provider of EDA tools for on-chip design verification.
Founded 12 years ago, Temento experienced rapid business expansion in Europe and in Asia, especially in Japan. Following sustained traction for its Dialite product line that targets FPGA designers requiring advanced verification capability, both the market and the product are now more mature to deploy operations in North America. Since design closure continues to challenge design teams, FPGA prototyping remains the mainstay to functionally validate a design running at-speed.
"FPGA design complexity places more pressure on the validation and debug phase" stated Patrice Deroux-Dauphin, CEO of Temento. "Designers need more advanced debug features to keep pace with time-to-market constraints, compared with the existing tools available from FPGA suppliers".
Temento's California office will support the entire North American territory while its sales partner, Cubic Micro will focus on expanding Temento's customer base in California.
About Temento
TEMENTO SYSTEMS S.A. is an innovative provider of Test, Debug and Verify Solutions for FPGA, System On Chip (SoC), Boards and Hardware Platforms. www.temento.com
About Cubic Micro
Cubic Micro is a leading International Manufacturer's Representative and RF Design Services company, located in Silicon Valley (Northern California), Japan (Yokohama and Osaka) and Singapore (RF Design Center). Cubic Micro provides major international semiconductor companies with support in sales, marketing, consulting and RF Design Services. www.cubicmicro.com
|
Related News
- M31 Debuts at the North American Design Automation Conference, Showcasing IP Solutions for Advanced Processes
- Alphawave IP announced as one of Deloitte's Technology Fast 50™ and North American Technology Fast 500™ 2022 award winners
- Alphacore Joins Forces with Quantum Leap Solutions to Bring World-Class Design IP to the North American Commercial Market
- TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium
- North American Semiconductor Equipment Industry Posts December 2021 Billings
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |