Wireless USB 1.1 Enriches End-User Experience
AMSTERDAM, Netherlands -- October 01, 2007 -- The Wireless USB Promoter Group – comprised of companies HP, Intel Corporation, LSI Corporation, Microsoft Corporation, NEC Electronics Corporation, NXP Semiconductors, and Samsung Electronics – today announced that they are developing the Wireless USB 1.1 Specification. Building on the well-established Wireless USB 1.0 Specification, advancements include new options for first-time association of devices, improved power efficiency, and support for UWB frequencies above 6 Ghz.
Preparing for the demands of future implementations, the Wireless USB Promoter Group is defining new features to make Wireless USB even easier to use. Among the features is a new method for first-time device association – the process to securely connect hosts and devices. Wireless USB 1.1 will support the use of Near Field Communication (NFC) capabilities, which is a proximity-based approach that allows users to easily introduce devices to their PCs through touch-and-go action. The Wireless USB 1.1 specification will also include updates to enhance power efficiency for better battery life, as well as add UWB upper band support for frequencies 6 Ghz and above.
“The Wireless USB 1.1 Specification builds on the key features – speed, ease of use, and security – that have made the 1.0 specification so successful,” said Jeff Ravencraft, USB-IF president. “The Wireless USB Promoter Group will define new features that make a great specification even better to improve product offerings for manufacturers and ultimately enhance the end-user experience.”
The Wireless USB 1.1 Specification will be finalized in the first half of 2008. Products that have undergone and passed certification testing have the opportunity to license and use the Certified Wireless USB logo on certified products. To learn more about the Wireless USB specifications, visit http://www.usb.org/developers/wusb/.
About Wireless USB
Wireless USB is the first high-speed wireless personal interconnect technology combining the speed and security of wired Hi-Speed USB with the ease-of-use-of wireless technology. It is backward compatible with wired USB, allows users to connect up to 127 devices and currently delivers a bandwidth of up to 480Mb/s at 3 meters and 110Mb/s at 10 meters. Wireless USB is based on the WiMedia Alliance Ultra-wideband Common Radio Platform.
The Wireless USB Promoter Group, consisting of seven companies—HP, Intel Corporation, LSI Logic, Microsoft Corporation, NEC Corporation, NXP Semiconductors, and Samsung Electronics—defined the core Wireless USB specification with the support of more than 100 contributor members. The group has now transitioned the specification’s management to the USB-IF, the supporting governing body of USB specifications. If a company intends to build and ship a product based on the Wireless USB 1.0 specification and wants to obtain a license, it should execute a WUSB 1.0 adopter’s agreement. Download the adopter agreement at: http://www.usb.org/wusb/.
Related News
- ARM Mali-200 GPU Compliant With OpenGL ES 2.0, OpenGL ES 1.1 and OpenVG 1.0
- Industry's First M3G 1.1 Compliant, Java 3D Graphics Engine
- Falanx Mali 110/55 IP Cores First to Support Latest OpenGL ES 1.1 Standard
- Summit Design Expands Its ESL Solution Suite with Vista 1.1 to Deliver Advanced Analysis and Debug for Expert and Novice SystemC Users
- Wipro Technologies unveils Version 1.1 of its Home Gateway Software Solution with DSL Support
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |