Tower Semiconductor Launches New Power Management Platform
MIGDAL HAEMEK, Israel -- October 29, 2007 -- Tower Semiconductor Ltd. (NASDAQ:TSEM)(TASE:TSEM), an independent specialty foundry, today announced the availability of its new Power Management Platform. The new offering combines high-voltage, fast-switching devices onto the base of its 0.18-micron technology platform. The technology is produced in Tower’s advanced Fab2 facility.
The new offering is a fully integrated dual/triple gate 0.18um Power Management platform that supports a wide scale of voltages, including 5, 12, 25 and 42 Volts. The switching devices are implemented by high-current-drive LDMOS transistors, and deliver world-class performance of RDSON = 25 mOhms*mmsq, at 33 Volts BVdss. This performance, which is on an integrated, non-Epi technology, enables implementation of single chip multi-ampere power management integrated circuits. Such integration suits well a wide range of power management applications that require cost effective and sophisticated power switching.
The underlying platform implements basic logic, analog and I/O, at both 5 Volts and 1.8 Volts (3.3V is available upon request.) Among the devices that complement the switches, Tower offers poly resistors; MIM capacitors; LV and HV bipolar transistors; Schottky diodes and thick metal conductors in both aluminum and copper. The platform includes all elements required for both analog and digital SoC power management designs.
In addition to the process and device offering, Tower provides a complete and exclusive Process Design Kit (PDK), as well as extensive customer support.
“We are very excited to provide existing and emerging customers with this comprehensive power management platform," said Yossi Netzer, general manager of Mixed-Signal and RF-CMOS product line at Tower Semiconductor. “The wealth of supporting devices we provide makes implementation easy and rewarding for any designer. The ability to attain effective switches on the same silicon as the control circuits enables the Tower platform to be a very attractive option with high performance, small form factor and attractive cost."
The power management IC market is estimated at $16B by 2010. Its accelerated growth, of 13% per annum is due to energy saving and product mobility trends. Tower’s new platform offering addresses the requirements of more than one-third of this market, specifically, products that require integrated solutions and switching voltages in the range of 5 Volts to 42 Volts. The primary applications where the platform will be applied are: LED drivers, Line drivers, Battery chargers, DC to DC converters, hand-held devices’ power supplies and automotive power management.
The power management platform is also available on Tower’s shuttle program for fast and low cost design verification and engineering samples.
About Tower Semiconductor Ltd.:
Tower Semiconductor Ltd. (Nasdaq:TSEM)(TASE:TSEM) is an independent specialty foundry that delivers customized solutions in a variety of advanced CMOS technologies, including digital CMOS, mixed-signal and RF (radio frequency) CMOS, CMOS image sensors, power management devices, and embedded non-volatile memory solutions. Tower’s customer orientation is complemented by its uncompromising attention to quality and service. Its specialized processes and engineering expertise provides highly flexible, customized manufacturing solutions to fulfill the increasing variety of customer needs worldwide. Offering two world-class manufacturing facilities with standard and specialized process technologies ranging from 1.0- to 0.13-micron, Tower Semiconductor provides exceptional design support and technical services to help customers sustain long-term, reliable product performance, while delivering on-time and on-budget results. More information can be found at http://www.towersemi.com.
|
Related News
- M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform
- Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs
- Intersil Signs MOU with Tower Semiconductor for Co-Development and Manufacturing of Next-Generation Power Management Platform
- Tower Semiconductor and Triune Systems to Collaborate on Power Management Platform
- Dialog Semiconductor and TSMC create a Process Platform to advance BCD power management leadership
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |