English
Renesas Technology Deploys CEVA Bluetooth IP in High Volume Consumer and Automotive Chipsets
SAN JOSE, Calif., Nov. 19, 2007 -- CEVA, Inc., a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications, today announced that Renesas Technology Corp. has commenced high-volume shipments of their chipsets with integrated Bluetooth connectivity powered by CEVA-Bluetooth IP. Renesas has successfully secured a number of key customers for their leading-edge solution, which will see their chip deployed in automotive applications for some of the world's leading car manufacturers.
"CEVA and Renesas have enjoyed a strong relationship in the development of Renesas' product offerings incorporating our CEVA-Bluetooth IP and we are very pleased to see their leading-edge technology deployed in high volumes," said Paddy McWilliams, Managing Director, Communications Product Line at CEVA. "We look forward to continuing our successful partnership with them and the continued development of new and innovative Bluetooth products."
"Throughout the development process of our chip, CEVA provided excellent technical support in addition to their comprehensive Bluetooth IP and we are pleased to complete Bluetooth IP in cooperation with CEVA," said Masayuki Hirokawa, senior manager of Automotive Application Engineering Dept.2, Automotive Semiconductor Business Unit at Renesas Technology Corp. "We acknowledge the success that the CEVA-Bluetooth IP has had in the successful development and deployment of our Bluetooth chipsets and envisage further success for our partnership."
CEVA offers a range of Bluetooth hardware and software IP ranging from Bluetooth 1.2 through to Bluetooth 2.0+EDR. CEVA's latest Bluetooth 2.0+EDR IP consists of an RTL baseband engine coupled with an ANSI C software stack. It is available as a discrete IP package for use with 3rd party embedded processors or it may be licensed together with a CEVA DSP for a complete Bluetooth platform. Such a platform can be also coupled with a complete set of audio codecs, voice codecs, echo cancellation and noise suppression algorithms, yielding an integrated Bluetooth and multimedia solution.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices.
For more information, visit http://www.ceva-dsp.com/
"CEVA and Renesas have enjoyed a strong relationship in the development of Renesas' product offerings incorporating our CEVA-Bluetooth IP and we are very pleased to see their leading-edge technology deployed in high volumes," said Paddy McWilliams, Managing Director, Communications Product Line at CEVA. "We look forward to continuing our successful partnership with them and the continued development of new and innovative Bluetooth products."
"Throughout the development process of our chip, CEVA provided excellent technical support in addition to their comprehensive Bluetooth IP and we are pleased to complete Bluetooth IP in cooperation with CEVA," said Masayuki Hirokawa, senior manager of Automotive Application Engineering Dept.2, Automotive Semiconductor Business Unit at Renesas Technology Corp. "We acknowledge the success that the CEVA-Bluetooth IP has had in the successful development and deployment of our Bluetooth chipsets and envisage further success for our partnership."
CEVA offers a range of Bluetooth hardware and software IP ranging from Bluetooth 1.2 through to Bluetooth 2.0+EDR. CEVA's latest Bluetooth 2.0+EDR IP consists of an RTL baseband engine coupled with an ANSI C software stack. It is available as a discrete IP package for use with 3rd party embedded processors or it may be licensed together with a CEVA DSP for a complete Bluetooth platform. Such a platform can be also coupled with a complete set of audio codecs, voice codecs, echo cancellation and noise suppression algorithms, yielding an integrated Bluetooth and multimedia solution.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices.
For more information, visit http://www.ceva-dsp.com/
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