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TSMC Ships One-Millionth 12-Inch 90NM Wafer Fast ramping process reaches milestone in 4½ years
Hsin-Chu, Taiwan -- December 3, 2007 --- Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330, NYSE: TSM) today announced that it has shipped its one-millionth 12-inch 90-nanometer (nm) wafer in record time. The record was reached in just 53 months, surpassing the 58 months it took the 0.13-micron process to reach that milestone.
TSMC Vice President, Corporate Development, Jason Chen credits the fast ramp of 90nm process to a number of factors, including a comprehensive IP and library portfolio and an accelerated yield learning curve. He also cited the TSMC GigaFab manufacturing strategy that enables faster qualification and assured compatibility that allows faster time-to-market and time-to-volume.
TSMC’s 90nm process covers a rich set of technology options including mixed signal, RF, CMOS image sensor, automotive, and embedded DRAM. The robust technology platform supports broad range of market segment demand such as hard disk drives, wireless LAN, Bluetooth, cellular RF, digital set-top boxes, digital TV, Blueray DVD, CMOS image sensors, flash controller and a variety of automotive applications.
About the 90nm Process
TSMC’s 90nm process family has low power (LP), general purpose (G), and high performance (GT) offerings. Features include multiple ultra-low, low, standard and high Vt options. Core operating voltages range from 1.0 to 1.2 volts and I/O voltages range from 1.8V to 3.3V. An extensive portfolio of process proven, silicon validated libraries and IP from TSMC’s internal design team and third-part partners is also available.
The 90nm process runs in both TSMC GigaFabs, Fab 12 and Fab 14. The Company is also developing an enhanced 90nm process, which should deliver even greater benefits in performance, cost, and efficiency.
About TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry industry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company’s total managed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
TSMC Vice President, Corporate Development, Jason Chen credits the fast ramp of 90nm process to a number of factors, including a comprehensive IP and library portfolio and an accelerated yield learning curve. He also cited the TSMC GigaFab manufacturing strategy that enables faster qualification and assured compatibility that allows faster time-to-market and time-to-volume.
TSMC’s 90nm process covers a rich set of technology options including mixed signal, RF, CMOS image sensor, automotive, and embedded DRAM. The robust technology platform supports broad range of market segment demand such as hard disk drives, wireless LAN, Bluetooth, cellular RF, digital set-top boxes, digital TV, Blueray DVD, CMOS image sensors, flash controller and a variety of automotive applications.
About the 90nm Process
TSMC’s 90nm process family has low power (LP), general purpose (G), and high performance (GT) offerings. Features include multiple ultra-low, low, standard and high Vt options. Core operating voltages range from 1.0 to 1.2 volts and I/O voltages range from 1.8V to 3.3V. An extensive portfolio of process proven, silicon validated libraries and IP from TSMC’s internal design team and third-part partners is also available.
The 90nm process runs in both TSMC GigaFabs, Fab 12 and Fab 14. The Company is also developing an enhanced 90nm process, which should deliver even greater benefits in performance, cost, and efficiency.
About TSMC
TSMC is the world’s largest dedicated semiconductor foundry, providing the industry’s leading process technology and the foundry industry’s largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company’s total managed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, one six-inch fab, as well as TSMC’s wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please see http://www.tsmc.com.
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