7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Effort behind reusing IP blocks is underestimated
(12/06/2007 4:27 PM EST)
GRENOBLE -- When intellectual property (IP) reuse entered the IC design paradigm more than ten years ago, the semiconductor industry expressed high expectations. IP reuse was indeed seen as a way to foster development productivity and output that would eventually offset the design productivity gap. Based on 1,200 benchmarked IC projects from more than 35 companies, Ron Collett, president and CEO of Numetrics Management Systems, Inc. (Cupertino, California), gave his views on how to achieve maximum IP reuse leverage.
"There are good and bad news about the reuse situation," stated Collett at the IP 07 Conference, organized by Design & Reuse SA, this week in Grenoble. Over the past ten years, reuse leverage more than doubled, and more reuse tends to translates into less project effort, shorter cycle times as well as fewer spins and less schedule slip.
Still on the positive side, Collett indicated that the average transistor count per block is growing and the number of blocks per chip is rising.
Moving to bad news, Collett noted that the average team size has doubled between the years 2000 and 2006. Collett also deplored that the semiconductor industry has serious schedule slip problems. About 85 percent of all IC projects miss their original schedule. "This is chaos. The average schedule slip is 44 percent, and high schedule slip means poor schedule predictability," he asserted.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Why have all broadcast powerhouses embraced intoPIX JPEG XS? Unraveling the secret behind industry leaders' unanimous adoption!
- China ten years behind and staying there
- Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with releases for core DMA Engines in RISC-V® & ARM® Systems and Peripherals to Memory Applications
- How Arm Total Design is built around 5 key building blocks
- Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results