Effort behind reusing IP blocks is underestimated
(12/06/2007 4:27 PM EST)
GRENOBLE -- When intellectual property (IP) reuse entered the IC design paradigm more than ten years ago, the semiconductor industry expressed high expectations. IP reuse was indeed seen as a way to foster development productivity and output that would eventually offset the design productivity gap. Based on 1,200 benchmarked IC projects from more than 35 companies, Ron Collett, president and CEO of Numetrics Management Systems, Inc. (Cupertino, California), gave his views on how to achieve maximum IP reuse leverage.
"There are good and bad news about the reuse situation," stated Collett at the IP 07 Conference, organized by Design & Reuse SA, this week in Grenoble. Over the past ten years, reuse leverage more than doubled, and more reuse tends to translates into less project effort, shorter cycle times as well as fewer spins and less schedule slip.
Still on the positive side, Collett indicated that the average transistor count per block is growing and the number of blocks per chip is rising.
Moving to bad news, Collett noted that the average team size has doubled between the years 2000 and 2006. Collett also deplored that the semiconductor industry has serious schedule slip problems. About 85 percent of all IC projects miss their original schedule. "This is chaos. The average schedule slip is 44 percent, and high schedule slip means poor schedule predictability," he asserted.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Why have all broadcast powerhouses embraced intoPIX JPEG XS? Unraveling the secret behind industry leaders' unanimous adoption!
- China ten years behind and staying there
- Digital Blocks AMBA Multi-Channel DMA Controller IP Core Family Extends Leadership with releases for core DMA Engines in RISC-V® & ARM® Systems and Peripherals to Memory Applications
- How Arm Total Design is built around 5 key building blocks
- Credo Joins with Industry Players to Announce Effort to Standardize CXL Active Electrical Cables & Optics at OCP Global Summit 2023
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era