Infineon Broadens Availability of Embedded Flash Process
The Infineon 130nm Embedded Flash process, which has been in volume production at Infineon plants since early 2006, is used for advanced microcontroller chips across applications ranging from automotive systems to low-power chip card devices. Along with related Non-Volatile Memory (NVM) intellectual property also licensed to IBM, the 130nm Embedded Flash process expands IBM's foundry capability to address applications requiring custom logic and high-density flash memory on a single chip.
"We are pleased to extend our long history of collaboration and technical development with IBM through this licensing and foundry agreement," said Peter Bauer, Member of the Management Board, Executive Vice President, Head of Automotive, Industrial & Multimarket business group at Infineon Technologies. "With this collaboration, Infineon leverages the value of its own manufacturing IP, gains a new source for volume manufacturing, and strengthens our working relationship with a long-term partner."
"We are broadening our semiconductor-offering portfolio by collaborating with Infineon, one of the world leaders of Embedded Flash technology," said Steve Longoria, vice president for Semiconductor Solutions, IBM Global Engineering Solutions. "This licensing agreement leverages our current technology base and complements our analog and mixed signal expertise."
Integration and qualification of the process in IBM's 200mm semiconductor fab in Burlington, Vermont, has already begun, and preliminary design kit availability is planned for the second half of 2008.
About Infineon
Infineon Technologies AG, Neubiberg, Germany, offers semiconductor and system solutions addressing three central challenges to modern society: energy efficiency, communications, and security. In the 2007 fiscal year (ending September), the company reported sales of Euro 7.7 billion (including Qimonda sales of Euro 3.6 billion) with approximately 43,000 employees worldwide (including approximately 13,500 Qimonda employees). With a global presence, Infineon operates through its subsidiaries in the U.S. from Milpitas, CA, in the Asia-Pacific region from Singapore, and in Japan from Tokyo. Infineon is listed on the Frankfurt Stock Exchange and on the New York Stock Exchange (ticker symbol: IFX). Further information is available at www.infineon.com.
|
Related News
- UMC Announces Availability of 40nm SST Embedded Flash Process
- Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology
- Infineon and TSMC Extend Technology and Production Partnership Agreement; Will Jointly Develop 65nm Embedded Flash Process Technology For Automotive and Chip Card Applications
- SMIC and CHINGIS Announce Availability of 0.18um Embedded Flash Process Technology and IP Portfolio
- Aplus Flash Technology announces availability of 0.35um embedded OTP EPROM IP with maximum performance: aplus' 0.35um embedded OTP IP offers high-performance , low-voltage operation on SMIC's 0.35um 2P3M OTP EPROM process
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |