CEVA Leads the Way at Mobile World Congress 2008 With Industry Leading Portfolio of Mobile Intellectual Property
More than forty Customers, Partners and OEMs to demonstrate CEVA-powered solutions for Wireless Baseband, Mobile Multimedia, Portable Audio, Voice-over-IP and Bluetooth at the show
SAN JOSE, Calif. -- Jan. 24, 2008 -- CEVA, Inc., the leading licensor of silicon intellectual property platform solutions and DSP cores, today announced that it will showcase its leadership in Mobile intellectual property through a range of new and innovative demonstration platforms at Mobile World Congress 2008 in Barcelona, Spain from February 11th through 14th. CEVA will be located at stand 2F07 in Hall 2.
United under the banner theme "CEVA Makes it Mobile™", CEVA will showcase a broad range of technologies for advanced mobile devices and portable multimedia applications, providing an exciting preview of upcoming consumer electronic products powered by CEVA's industry-leading technologies. Visitors to CEVA's stand will have the opportunity to try the "MediaSphere" demonstration platform, offering the ultimate portable multimedia experience, incorporating CEVA's interactive touch-screen media player reference device in a unique setting.
Also at the show, more than forty leading semiconductor companies and handset OEMs will display CEVA-powered™ products and solutions, including Broadcom, Chipnuts, Comsys Mobile, Infineon, InterDigital, LG Electronics, i-mate, NXP Semiconductors, Palm, Panasonic, Samsung, Sharp, Sony Ericsson, Spreadtrum Communications and ZTE Corporation.
Demonstration platforms on display at CEVA's stand 2F07 in Hall 2 include:
- PMP Reference Device -- "The MediaSphere Demo": An interactive touch-screen media player prototype device powered by CEVA's Mobile-Media™, decoding various multimedia files, including "My Movies" (H.264, MPEG4, RealVideo, VC-1, H.263 with synced audio), "My Music" (MP3, WMA, HE-AAC) and "My Pictures" (JPEG).
- Streaming Multimedia Encoder: Real-time capturing, encoding and streaming of H.264 to a standard PC media player, powered by the fully programmable CEVA Mobile-Media™ solution.
- Multi-Format Multimedia Decoder: CEVA's Mobile-Media™ decoding advanced multimedia clips at D1 resolution, 30fps. Demo features highest-quality H.264 mixed with HE-AAC streams, all decoded completely in software using a single programmable multimedia engine.
- Complete VoIP System: An end-to-end IP calling system, using two CEVA-VoP™ reference boards connected over Ethernet, featuring high voice quality and various telephony features.
- 5.1 Channel Audio Player: A fully integrated, low power, low cost CEVA-Audio™ platform, decoding various multi-channel audio formats in highest quality, including Dolby Digital, Dolby Digital Plus, HE-AAC, WMA.
- MicroQ®: QSound, a CEVA Technology Partner, will demonstrate MicroQ®, a software MIDI synthesizer engine for polyphonic ringtones and music enhancement effects, running on the CEVA-TeakLite DSP.
To request a meeting with CEVA at Mobile World Congress 2008, email info@ceva-dsp.com .
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores for mobile, consumer electronics and storage applications. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2006, CEVA's IP was shipped in over 190 million devices.
For more information, visit http://www.ceva-dsp.com/
|
Ceva, Inc. Hot IP
Related News
- CEVA DSPs Continue to Lead the Way at Mobile World Congress
- CEVA to Showcase Continued Leadership in Intellectual Property for Wireless Handset Applications at 3GSM World Congress 2007
- CEVA at MWC 2015: Powering a New Era of Intelligent Mobile Devices with the Industry's Leading Portfolio of Communications, Multimedia and Connectivity IPs
- CEVA to Showcase a Range of Solutions for the Future of Mobile Computing at Mobile World Congress 2014
- CEVA to Showcase Industry-Leading Platform IP for Communications, Vision, Imaging, Audio and Voice at Mobile World Congress 2013
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |