STMicroelectronics Unveils its Next-Generation Integrated Bluetooth and FM-Radio Transceiver System on Chip in 65nm Process Technology
ST's STLC2690 single-chip Bluetooth v2.1+EDR with fully integrated FM RDS radio receiver and short-range FM RDS transmitter enables new generation of media-rich mobile phones, smart phones and other battery-driven portable devices
Geneva, January 24,2008 - STMicroelectronics (NYSE:STM), a leader in wireless connectivity solutions for mobile and consumer markets, today introduced its 4th-generation Bluetooth®/FM Radio combo solution, which meets the demanding integration and cost requirements of the cellular phone market. By combining Bluetooth wireless personal-area-network functionality with an FM radio transceiver in a single 65nm chip, the STLC2690 offers leading-edge integration and performance. This combination of features and functionality saves space and costs for manufacturers of portable products, while delivering to consumers stereo FM R(B)DS reception (RX) direct to their Bluetooth headsets. The fully integrated short range FM R(B)DS transmitter (TX) allows users to enjoy stored music content on any in-car or home FM radio tuner and delivers increased versatility to the mobile device. This new chip from ST is manufactured in ST’s advanced low-leakage ultra-low-power 65nm RFCMOS technology, and reinforces ST’s position of being able to offer the lowest power consumption in the Bluetooth world.
The STLC2690 is compliant with BT v2.1+EDR and further increases the field-proven class-1.5 Bluetooth output power, requiring only one supply voltage and without any calibration in production. The Bluetooth link stability is dramatically increased by also further improving the Bluetooth receiver sensitivity, while reducing the best-in-class current consumption by up to 35% compared to former generation products in 130nm technology.
The integrated FM receiver sets a new world standard for receiver sensitivity and with real-time programmable filters for optimum search and sensitivity stability, the STLC2690 can also be used with integrated FM antennas. The device supports all deployed R(B)DS services and all worldwide FM bands (65 to 108MHz). The short-range FM transmitter is specifically designed for use in mobile phones that also take advantage of the presence of a FM receiver. Proprietary SureTune™ technology automatically selects the optimal FM transmit frequency, while the programmable high output power allows stable operation even when using integrated antennas with poor efficiency. The STLC2690 delivers a stable and user-friendly FM transmission implementation with real enhancement of the user experience in mobile applications. The new STLC2690 comes in a Wafer Level Chip Scale Package (WLCSP) with a 0.4mm pitch. Its ultra-low external BOM count allows a PCB footprint as small as 36mm2. The pin-out arrangement of the STLC2690 is also suitable for use on low-cost PCB assemblies. STLC2690 samples are already being evaluated by several leading handset manufacturers and volume mass production is scheduled for the second half of 2008. Further information on ST’s Bluetooth and FM devices and its complete Bluetooth portfolio at www.st.com/bluetooth.
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2006, the Company's net revenues were $9.85 billion and net earnings were $782 million. Further information on ST can be found at www.st.com.
|
Related News
- Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis
- Arm, Cadence and Xilinx Introduce First Arm Neoverse System Development Platform for Next-Generation Cloud-to-Edge Infrastructure, Implemented on TSMC 7nm Process Technology
- CoWare Unveils Next-Generation, System-Centric Analysis for CoWare Platform Architect and CoWare Virtual Platform
- STMicroelectronics Unveils Ultra-Low-Power Technology Platform for 8-bit and 32-bit Microcontrollers, Enabling Next-Generation Power-Saving Products
- SiRF Debuts SiRFlinkIII Combo Radio IC to Drive Next-Generation Mobile Convergence Devices
Breaking News
- GUC Joins Arm Total Design Ecosystem to Strengthen ASIC Design Services
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
- Micon Global and Silvaco Announce New Partnership
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
Most Popular
- Arm loses out in Qualcomm court case, wants a re-trial
- Micon Global and Silvaco Announce New Partnership
- Jury is out in the Arm vs Qualcomm trial
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- QuickLogic Announces $6.575 Million Contract Award for its Strategic Radiation Hardened Program
E-mail This Article | Printer-Friendly Page |