Qualcomm Makes Next-generation Mobile Internet Accessible with New Single-chip Solution
SAN DIEGO -- February 11, 2008 -- Qualcomm Incorporated, a leading developer and innovator of advanced wireless technologies and data solutions, today introduced a new single-chip solution bringing unprecedented multimedia and broadband capabilities to the mass-market tier. The Qualcomm Single Chip™ (QSC™) QSC6295™, which leverages advanced 45 nanometer CMOS process technology, combines rich multimedia, power-saving innovations and broadband data speeds to redefine the capabilities of the next generation of mainstream handsets. With support for downloads of up to 10.2 Mbps, uploads of up to 5.76 Mbps, compelling multimedia content and integrated Bluetooth/FM/GPS, the QSC6295 is helping drive the migration of popular Internet community and media sharing services to the mobile space. New innovations in power consumption enable up to a full day of talk time and more than a month of standby time. The QSC6295 is scheduled to sample in the first quarter of 2009.
“As some of today's most popular social networking and other Internet-based applications migrate to the mobile space, the new technologies integrated into the QSC6295 solution will enable the optimum user experience,” said Steve Mollenkopf, senior vice president of product management for Qualcomm CDMA Technologies. “The industry-leading innovation and integration of our growing single-chip family empowers handset manufacturers to bring new capabilities to the market and makes these capabilities accessible to a wider base of wireless users around the world.”
The QSC6295 offers a unique combination of advanced modem capabilities, including HSPA and HSPA+, and rich multimedia features to deliver a truly next-generation mobile user experience on mass-market handsets. With the addition of the QSC6295 solution to Qualcomm's roadmap, complementing Qualcomm's entry-level solutions - such as the QSC6240™ and QSC6270™ - and dual-core Smartphone chipsets such as the QSC7230™, the Company's single-chip family now spans all market segments, providing highly integrated, cost-effective solutions for device manufacturers targeting any market tier.
The QSC6295 integrates baseband, multimedia processing and radio functionality into a single chip, delivering significant cost- and time-to-market advantages to help drive wireless broadband and 3G adoption in mass markets around the world. Key features include:
- 400 MHz ARM 11, delivering powerful processing performance
- Support for WQVGA video playback and recording with TV-out
- 5.0 megapixel camera
- 3D hardware-accelerated graphics
- Integrated gpsOne® baseband and radio
- Integrated Bluetooth® baseband and radio, FM radio and USB 2.0 HS
- Support for all UMTS bands and quad-band EGPRS, as well as receive diversity for enhanced data throughput performance
- 12mm x 12mm package
Qualcomm Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., Qualcomm is included in the S&P 500 Index and is a 2007 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
|
Related News
- STMicroelectronics Introduces Next-Generation Single-Chip Automotive Navigation Processor with Embedded GPS
- Qualcomm Introduces Single-Chip 802.11n Wireless LAN Solution for Handsets and Mobile Devices
- Broadcom Announces Groundbreaking 65 Nanometer Single-Chip Bluetooth 2.1 + EDR Solution for Mobile Handsets
- Beceem Introduces World's First Single-Chip, 65 Nanometer Mobile WiMAX Solution - Sets New Standard for Low Power Consumption
- New IBM Technology Enables Single-Chip Mobile Solutions
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |