Renesas Technology Releases 50 New MCU Products Comprising 11 Groups, Each Built Around the R32C/100 CPU Core and Integrating High-Speed On-Chip Flash Memory
Tokyo -- February 14, 2008 -- Renesas Technology Corp. today announced the 50 new products comprising 11 groups as new additions to its R32C/100 Series of MCUs with on-chip flash memory for automotive systems. The MCUs in this series are built around the R32C/100 high-performance 32-bit CPU core, the most advanced available in the M16C Family of complex instruction set computer (CISC) MCUs.
Sample shipments will begin in May 2008 in Japan with the R32C/120 Group and R32C/121 Group, which are suitable for applications such as body control. These will be followed in July 2008 by the R32C/133 Group and R32C/134 Group with on-chip peripheral functions including a communication controller supporting FlexRay™,*1 a next-generation automotive communications protocol. Finally, sample shipments of the R32C/151, R32C/152, R32C/153, R32C/156, R32C/157, R32C/160, and R32C/161 Groups will begin in July 2008 sequentially in Japan .
Product BackgroundRecently in the automotive systems field, the number of electronic control units (ECUs) used per vehicle has increased dramatically, and the resulting increase in the volume of data transferred over automotive LANs is striking. In addition, control methods are becoming more complex, which has led to an increase in the size of the software programs used to implement them. As a result, demand is growing for MCUs (the core devices in ECUs) with sophisticated functions and improved performance to execute large programs rapidly.
Renesas Technology has developed and delivered to the market MCU products designed to meet this demand. The R32C/100 Series, part of the M16C Family of CISC MCUs, aims to meet the need for still higher performance with an extensive product lineup offering advanced on-chip peripheral functions. These include communication functions such as multichannel CAN*2 support and a communication controller implementing the FlexRay high-speed communication protocol.
Features(1) | Common features | ||||||||||||||||||||
The features common to all 11 product groups are summarized below.
| |||||||||||||||||||||
(2) | Features of individual groups | ||||||||||||||||||||
In addition to the common features listed under (1) above, these groups are wide range lineup products combining of different flash memory and RAM capacities, the configuration and number of channels of CAN, LIN*3 , and other interface, and so on. This enables the developer to select a product that best matches the system specifications. The features specific to each group are summarized below.
|
Renesas Technology is currently developing a bus driver with support for FlexRay and plans to eventually offer system solutions including MCU and bus driver components. The company is also an active member of standardization bodies such as the FlexRay Consortium, JasPar.*5, and AUTOSAR.*6 In cooperation with partner tool vendors, Renesas Technology offers software components that comply with standards established by AUTOSAR and JasPar. Renesas Technology and its partners supply customers with development environments they can use with confidence.
Starting in 2009, Renesas Technology plans to release a range of new products featuring the new RX Family CPU. RX Family products will provide compatibility with existing MCUs based on CISC CPUs, and they will further extend the capabilities of the products being announced today.
Notes: | 1. | FlexRay: A communication protocol for next-generation vehicle control applications that is promoted by the FlexRay Consortium. FlexRay is a registered trademark of Daimler AG. |
2. | CAN (Controller Area Network): An automotive network specification promoted by Robert Bosch GmbH of Germany. | |
3. | LIN (Local Interconnect Network): A network specification that allows networks to be built inexpensively. | |
4. | X-by-Wire: A technology that uses electrical actuators and motors, and electronic control, to implement functions that use hydraulic power or the like to operate mechanical systems, such as steering and braking. | |
5. | JasPar ( Japan Automotive Software Platform and Architecture): A non-profit organization, whose members are mainly automakers and manufacturers of electrical components, that works to promote the adoption of uniform software and the standardization of in-vehicle networks in motor vehicles. Japan is main activity base. | |
6. | AUTOSAR (Automotive Open System Architecture): A non-profit organization, whose members are mainly automakers and manufacturers of electrical components, that works to promote the adoption of uniform software and electronic architectures in motor vehicles. |
Typical Applications
- Automotive systems: Controllers for body, chassis, airbag units, etc,
- Industrial equipment: Factory automation equipment, etc.
Prices in Japan
Product Name | On-Chip Flash Memory/RAM | CAN | LIN | Flex Ray | Package | Sample Price [Tax Included] (Yen) | |
R32C/120 Group | R5F64200JFB | 128 KB + 12KB /12 KB | 1 | 2 | - | 100-pin LQFP | 1,000 to 2,000 |
R5F64201JFB | 256 KB + 12KB /20KB | 1 | 2 | - | 100-pin LQFP | ||
R32C/121 Group | R5F64210JFB | 128 KB + 12KB /12KB | 2 | 2 | - | 100-pin LQFP | |
R5F64213JFB | 512 KB + 12KB /32KB | 2 | 2 | - | 100-pin LQFP | ||
R32C/133 Group | R5F64331JFD | 256 KB + 12KB /20KB | 2 | - | 2 | 144-pin LQFP | |
R5F64333JFD | 512 KB + 12KB /32KB | 2 | - | 2 | 144-pin LQFP | ||
R32C/134 Group | R5F64341JFD | 256 KB + 12KB /20KB | 3 | - | 2 | 144-pin LQFP | |
R5F64343JFD | 512 KB + 12KB /32KB | 3 | - | 2 | 144-pin LQFP | ||
R32C/151 Group | R5F64514JFD | 768 KB + 16KB /48KB | 2 | 8 | - | 144-pin LQFP | |
R5F64515JFD | 1024 KB + 16KB /48KB | 2 | 8 | - | 144-pin LQFP | ||
R32C/152 Group | R5F64524JFD | 768 KB + 16KB /48KB | 3 | 8 | - | 144-pin LQFP | |
R5F64525JFD | 1024 KB + 16KB /48KB | 3 | 8 | - | 144-pin LQFP | ||
R32C/153 Group | R5F64534JFD | 768 KB + 16KB /48KB | 4 | 8 | - | 144-pin LQFP | |
R5F64535JFD | 1024 KB + 16KB /48KB | 4 | 8 | - | 144-pin LQFP | ||
R32C/156 Group | R5F64561JFD | 256 KB + 12KB /20KB | 2 | 4 | - | 144-pin LQFP | |
R5F64563JFD | 512 KB + 12KB /32KB | 2 | 4 | - | 144-pin LQFP | ||
R32C/157 Group | R5F64571JFD | 256 KB + 12KB /20KB | 3 | 4 | - | 144-pin LQFP | |
R5F64573JFD | 512 KB + 12KB /32KB | 3 | 4 | - | 144-pin LQFP | ||
R32C/160 Group | R5F64600JFP | 128 KB + 12KB /12KB | 1 | 1 | - | 80-pin LQFP | |
R5F64601JFP | 256 KB + 12KB /20KB | 1 | 1 | - | 80-pin LQFP | ||
R32C/161 Group | R5F64610JFP | 128 KB + 12KB /12KB | 2 | 1 | - | 80-pin LQFP | |
R5F64611JFP | 256 KB + 12KB /20KB | 2 | 1 | - | 80-pin LQFP |
Note: For each group, the products with the maximum and minimum memory capacity are listed above. Also, the products listed above have a maximum operating temperature of 85ºC. Versions with different maximum operating temperature specifications are also available.
Additional Information* A specification list for each part number, and documentation including pin arrangements, specification overviews and explanations of pin functions are available.
http://www.renesas.com/r32c100
(1) Specifications of R32C/120 Group and R32C/121 Group
Item | Specifications of R32C/120 Group | Specifications of R32C/121 Group | ||||
Product name | R5F64200 JFB | R5F64201 JFB | R5F64210 JFB | R5F64211 JFB | R5F64212 JFB | R5F64213 JFB |
R5F6420E JFB | R5F6420F JFB | R5F6421E JFB | R5F6421F JFB | R5F6421G JFB | R5F6421H JFB | |
CPU core | R32C/100 | |||||
Power supply voltages | VCC: 3.0 V to 5.5 V | |||||
Max. operating frequency | 64 MHz | |||||
Min. instruction execution time | 15.625 nsec at 64 MHz operation | |||||
Basic instruction set | 108 instructions | |||||
Operating temperature range | -40 to 85 ºC (Versions of -40 to 125 ºC are also available. And Versions of -40 to 105 ºC are available to meet the demand.) | |||||
Flash memory | 128 KB | 256 KB | 128 KB | 256 KB | 384 KB | 512 KB |
E 2 Data Flash |
| |||||
Data Flash | 4 KB x 2 blocks | |||||
RAM | 12 KB | 20 KB | 12 KB | 20 KB | 24 KB | 32 KB |
On-chip peripheral functions |
| |||||
1 channel | 2 channels | |||||
| ||||||
| ||||||
| ||||||
1 channel | 3 channels | |||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
Package | 100-pin LQFP (14 mm x 14 mm, 0.5 mm pin pitch) |
(2) Specifications of R32C/133 Group and R32C/134 Group
Item | Specifications of R32C/133 Group | Specifications of R32C/134 Group | ||||
Product name | R5F64331 JFD | R5F64332 JFD | R5F64333 JFD | R5F64341 JFD | R5F64342 JFD | R5F64343 JFD |
CPU core | R32C/100 | |||||
Power supply voltages | VCC0: 3.0 V to 3.6 V, VCC: 4.2 V to 5.5 V | |||||
Max. operating frequency | 60 MHz | |||||
Min. instruction execution time | 16.666 nsec at 60 MHz operation | |||||
Basic instruction set | 108 instructions | |||||
Operating temperature range | -40 to 85 ºC (Versions of -40 to 125 ºC are also available.) | |||||
Flash memory | 256 KB | 384 KB | 512 KB | 256 KB | 384 KB | 512 KB |
E 2 Data Flash |
| |||||
Data Flash | 4 KB x 2 blocks | |||||
RAM | 20 KB | 24 KB | 32 KB | 20 KB | 24 KB | 32 KB |
On-chip peripheral functions |
| |||||
| ||||||
2 channel | 3 channel | |||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
Package | 144-pin LQFP (20 mm x 20 mm, 0.5 mm pin pitch) |
(3) Specifications of R32C/151 Group, R32C/152 Group and R32C/153 Group
Item | Specifications of R32C/151 Group | Specifications of R32C/152 Group | Specifications of R32C/153 Group | |||
Product name | R5F64514 JFD | R5F64515 JFD | R5F64524 JFD | R5F64525 JFD | R5F64534 JFD | R5F64535 JFD |
R5F6451M JFD | R5F6451 N JFDB | R5F6452M JFD | R5F6452N JFD | R5F6453M JFD | R5F6453N JFD | |
CPU core | R32C/100 | |||||
Power supply voltages | VCC: 3.0 V to 5.5 V | |||||
Max. operating frequency | 64 MHz | |||||
Min. instruction execution time | 15.625 nsec at 64 MHz operation | |||||
Basic instruction set | 108 instructions | |||||
Operating temperature range | -40 to 85ºC (Versions of -40 to 125ºC are also available. And Versions of -40 to 105ºC are available to meet the demand.) | |||||
Flash memory | 768 KB | 1024 KB | 768 KB | 1024 KB | 768 KB | 1024 KB |
E2 Data Flash |
| |||||
Data Flash | 4 KB x 2 blocks | |||||
RAM | 48 KB | 48 KB | 48 KB | 48 KB | 48 KB | 48KB |
On-chip peripheral functions |
| |||||
2 channels | 3 channels | 4 channels | ||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
Package | 144-pin LQFP (20 mm x 20 mm, 0.5 mm pin pitch) |
(4) Specifications of R32C/156 Group and R32C/157 Group
Item | Specifications of R32C/156 Group | Specifications of R32C/157 Group | ||||
Product name | R5F64561 JFD | R5F64562 JFD | R5F64563 JFD | R5F64571 JFD | R5F64572 JFD | R5F64573 JFD |
R5F6456F JFD | R5F6456G JFD | R5F6456H JFD | R5F6457F JFD | R5F6457G JFD | R5F6457H JFD | |
CPU core | R32C/100 | |||||
Power supply voltages | VCC: 3.0 V to 5.5 V | |||||
Max. operating frequency | 64 MHz | |||||
Min. instruction execution time | 15.625 nsec at 64 MHz operation | |||||
Basic instruction set | 108 instructions | |||||
Operating temperature range | -40 to 85ºC (Versions of -40 to 125ºC are also available. And Versions of -40 to 105ºC are available to meet the demand.) | |||||
Flash memory | 256 KB | 384 KB | 512 KB | 256 KB | 384 KB | 512 KB |
E 2 Data Flash |
| |||||
Data Flash | 4 KB x 2 blocks | |||||
RAM | 20 KB | 24 KB | 32 KB | 20 KB | 24 KB | 32 KB |
On-chip peripheral functions |
| |||||
2 channels | 3 channels | |||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
| ||||||
Package | 144-pin LQFP (20 mm x 20 mm, 0.5 mm pin pitch) |
(5) Specifications of R32C/160 Group and R32C/161 Group
Item | Specifications of R32C/160 Group | Specifications of R32C/161 Group | ||
Product name | R5F64600JFP | R5F64601JFP | R5F64610JFP | R5F64611JFP |
R5F6460EJFP | R5F6460FJFP | R5F6461EJFP | R5F6461FJFP | |
CPU core | R32C/100 | |||
Power supply voltages | VCC: 3.0 V to 5.5 V | |||
Max. operating frequency | 48 MHz | |||
Min. instruction execution time | 20.8 nsec at 48 MHz operation | |||
Basic instruction set | 108 instructions | |||
Operating temperature range | -40 to 85ºC (Versions of -40 to 125ºC are also available. And Versions of -40 to 105ºC are available to meet the demand.) | |||
Flash memory | 128 KB | 256 KB | 128 KB | 256 KB |
E 2 Data Flash |
| |||
Data Flash | 4 KB x 2 blocks | |||
RAM | 12 KB | 20 KB | 12 KB | 20 KB |
On-chip peripheral functions |
| |||
1 channel | 2 channels | |||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
| ||||
Package | 80-pin LQFP (12 mm x 12 mm, 0.5 mm pin pitch) |
|
Related News
- Renesas Technology Releases SuperH Family Microcontroller, the SH72544R, Featuring 200 MHz Operation and 2.5 Mbytes Large-Capacity On-Chip Flash Memory
- Hitachi and Renesas Technology Develop 1.5-V Low-Power, High-Speed Phase Change Memory Module for On-Chip Nonvolatile Memory Applications
- Renesas Technology Releases SuperH Family SH7211F Single-Chip Microcontroller with On-Chip Flash Memory, Achieving World's Top-Level Operating Speed of 160 MHz
- DFI Group Releases Initial Version of the DFI 5.0 Specification for High-Speed Memory Controller and PHY Interface
- Renesas Electronics Develops Industry's First 28nm Embedded Flash Memory Technology for Microcontrollers
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |