English
OCP-IP Announces Part 1 of Network On Chip Benchmarking Specification
BEAVERTON, Ore.-- March 03, 2008 -- OCP-IP today announced that part one of the Network On Chip (NoC) Benchmarking specification has entered member review. Part one of the specification details requirements and features for application programs, synthetic micro-benchmarks, and abstract benchmark applications. It discusses ways to measure and benchmark reliability, fault tolerance, and testability of the on-chip communication fabric.
This specification was completed with the collaboration of a number of world’s most prestigious universities working on NoC research including: University of British Columbia, Carnegie Melon University, Royal Institute of Technology, Tampere University of Technology and Washington State University and was supported by cooperation and participation of industry members from the OCP-IP NoC Benchmarking Working Group (NoC BWG). These companies include: GreenSocs, Nokia, Sonics, Synopsys, Texas Instruments, and Toshiba.
Members wishing to review and comment on part one of the NoC spec or join the OCP-IP NoC Benchmarking Working Group are invited to immediately contact admin@ocpip.org. To download a free copy of OCP-IP’s white paper discussing the topic of NoC Benchmarking, visit http://www.ocpip.org.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE:NOK), Sonics Inc., Synopsys [SNPS], Texas Instruments (NYSE:TXN), and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. For additional background and membership information, visit www.OCPIP.org.
This specification was completed with the collaboration of a number of world’s most prestigious universities working on NoC research including: University of British Columbia, Carnegie Melon University, Royal Institute of Technology, Tampere University of Technology and Washington State University and was supported by cooperation and participation of industry members from the OCP-IP NoC Benchmarking Working Group (NoC BWG). These companies include: GreenSocs, Nokia, Sonics, Synopsys, Texas Instruments, and Toshiba.
Members wishing to review and comment on part one of the NoC spec or join the OCP-IP NoC Benchmarking Working Group are invited to immediately contact admin@ocpip.org. To download a free copy of OCP-IP’s white paper discussing the topic of NoC Benchmarking, visit http://www.ocpip.org.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE:NOK), Sonics Inc., Synopsys [SNPS], Texas Instruments (NYSE:TXN), and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. For additional background and membership information, visit www.OCPIP.org.
|
||||||
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |