Coresonic announces the first of its wireless modem hardware solutions with WiMax 'personality pack' enabling quick addition of IEEE802.16
Linköping, Sweden -- March 11, 2008 -- Coresonic AB, a provider of leading-edge baseband processor technology optimized for next generation multimode wireless modems, has announced the first of a series of complete hardware solutions which will allow semiconductor manufacturers to quickly and cost-effectively implement WiMax functionality into their semiconductor devices. The new WiMax 'personality pack', based on the company's LeoCore programmable baseband processor technology, provides complete IEEE802.16 functionality, from the RF interface through to the central processor interface.
This personality pack is the first of a number of complete hardware solutions that Coresonic will be developing - other solutions will be announced for LTE, mobile media, short range communications, high speed short range communications, as well as legacy cellular systems.
Rick Clucas, CEO of Coresonic, said, "We have already spoken to a number of semiconductor companies and the main feedback we are receiving from them is that no other licensable solution appears to come close to our solution in terms of size and power consumption - in fact, some instruction caches are as large as our complete baseband processor solution!" He added, "Recently a number of companies have made announcements in the market of WiMax/DVB-T or DVB-T/H solutions, that we estimate are approximately 4 to10 times the size of our solution."
Commenting on the market challenge for programmable baseband processors, Rick Clucas says, "OEMs are looking for a complete product which is low power and low cost - not lots of power hungry chips. The IP business model that we have chosen together with the personality packs for different standards is the only way that we believe this challenge can be met rapidly and efficiently."
Coresonic's WiMax personality pack supports the mobile WiMax 802.16e-2005 mobile system profile rev 1.4, which will support other modes such as 802.16d and 802.16j. The pack performs everything from ADC/DAC interface to FEC, including digital front-end signal conditioning, synchronization, MIMO channel estimation/compensation, error correction and chase combing. All blocks provided enable a complete solution from the RF interface to interfacing to a CPU (central processor) to run the MAC layer; the processing intensive elements are implemented in hardware to minimize the load on the MAC CPU.
About Coresonic
Coresonic AB delivers the most silicon and area efficient solutions for next generation modem applications enabling its customers to quickly add WiMax, LTE, DVB-T/H, ISDP-T, T-DMB, DAB or 802.11 functionality to their own products. This is achieved using the company's unique patented programmable baseband processor technology optimized for WiMAX and 4G wireless modems. Proven in silicon and delivered as semiconductor intellectual property, its patented LeoCore multimode modem technology can be rapidly integrated with the supplied protocol specific firmware to meet rapidly changing wireless standards as they evolve for all types of mobile wireless devices - from mobile phones and PDAs to wireless networking and digital broadcasting. Founded in 2004 from the research center Stringent at Linköping University, Sweden, Coresonic is headquartered in Sweden. Read more at www.coresonic.com.
|
Related News
- Flex Logix and DARPA Expand Partnership with the Addition of Silicon Proven EFLX eFPGA in 12 and 16 nm Process Technologies for DARPA's Toolbox Initiative
- Altera Delivers Industry's First FPGA-based Serial RapidIO Gen2 Solution Enabling Next-Generation Wireless Base Station Deployments
- Renesas Electronics' Acquisition of Nokia's Wireless Modem Business Completed
- IPWireless and Altair Semiconductor Partner to Develop Wireless Industry's First Multi-Band, Multi-Mode Long Term Evolution (LTE) Modem
- Renesas Electronics to acquire Nokia's wireless modem business; companies to form strategic business alliance for modem technology development
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |