Dolphin Integration announces an ultra High Density library in shrunk processes.
Dolphin Integration's standard cell library SESAME uHDvLC is already known for its cost reduction capability in the standard processes 0.18 and 0.13 µm. Its ultra High Density enables silicon costs reduction and its very Low Power offers the possibility to reduce packaging costs.
SoC designers can now benefit from the availability of SESAME uHDvLC in shrunk processes such as 0.16 µm, 0.152 µm and 0.11 µm.
For more information:
http://www.dolphin.fr/flip/sesame/018/sesame_018_uHDvLC.html
A free “Evaluation Tutorial” is provided with each evaluation kit for a smooth and fast discovery.
|
Dolphin Semiconductor Hot IP
Related News
- Ultra high density standard cell library SESAME uHD-BTF to enrich Dolphin Integration's panoply at TSMC 90 nm eF and uLL
- Dolphin Integration enable Dongbu HiTek's users to benefit from their ultra high density standard cell library
- Dolphin Integration enables 1P3M/1P4M SoC designs at 180 nm with their ultra high density standard cell library
- Dolphin Integration introduces an ultra High Density Library decreasing the 130 nm logic area up to 30%
- Disruption in library offering for the 90 nm LP process with Dolphin Integration's new generation of High Density Standard Cells
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |