Virage Logic first to deliver 0.15 micron Embedded Memory Compilers
FREMONT, Calif. - March 6, 2000 - Virage Logic Corporation, the leader in embedded memory, today announced that it is the first company to deliver 0.15 micron embedded memory compilers. The first instances from its 0.15 Custom-Touchä ASAP (Area, Speed, and Power) family of memory compilers was delivered to Taiwan Semiconductor Manufacturing Corporation (TSMC) on November 30, 1999, with the complete compiler family scheduled to be delivered by the end of Q1, 2000. With the wide portfolio of embedded memory compilers available on TSMC, Virage is well positioned to address the needs of customers designing in 0.35, 0.25, 0.18 and now 0.15 microns.
"Through the cooperative efforts of Virage Logic and TSMC our customers have access to reliable, high-density embedded memory designs targeted to TSMC's 0.15-micron process technology," said Kurt Wolf, director of marketing at TSMC North America. "We look forward to other Virage memories targeted to the 0.15 micron level and below."
"Virage is a market driven company and we are delivering products needed by the marketplace, " said Krishna Balachandran, director of product marketing for Virage. "There is a great demand from customers for embedded memory compilers in 0.15 micron technology and we are seeing several design starts in this new technology".
Delivering Custom-Touch ASAP Memory Compilers at 0.15 Microns
Virage Logic's first 0.15 micron offering is its Custom-Touch ASAP family for TSMC's next-generation process. ASAP (Area, Speed and Power) is a product family of memory compilers offering industry leading specifications in area, power and speed. Having memories optimized in this manner allows TSMC's customers to select the right memory for their application. ASAP will be available initially in a 1-port and 2-port high density SRAM and 2-port register file.
The ASAP compiler family will be available off-the-shelf the end of Q1` 2000 with prices starting at $100,000.
About Virage Logic
Virage Logic is the technology and market leader in application-specific embedded memory. The company's products include optimized memory compilers, software tools that enable the development and reuse of memory, and custom memory design services. Virage's customers include the leading semiconductor and electronic systems companies designing ASIC and system-on-a-chip applications. The memory products developed by Virage are used by fabless semiconductor companies targeting pure-play foundries and are also optimized for semiconductor companies. Founded in January 1996, the company is privately held, and is located at 46501 Landing Pkwy., Fremont, Calif. 94538. Telephone: (877) 360-6690 (toll free) or (510) 360-8000. Fax: (510) 360-8099. For more information, please visit www.viragelogic.com
Company Contact:
Nanette Sisk
Virage Logic
(510)360-8062
E-mail: nanette@viragelogic.com
Related News
- Virage Logic is first to deliver embedded memory on TSMC 0.13 micron process
- eASIC Announces Implementation of Its Configurable Logic Core in UMC's 0.15 Micron Process
- UMC and Virage Logic Announce Qualification of Embedded Non-Volatile Memory Technology on UMC's 0.18um Logic Process
- Virage Logic offers Hi-Performance, Phase Compliant Embedded Memory Products for UMC's Advanced 0.13 Micron Manufacturing Process
- Impinj Delivers Logic Nonvolatile Memory in Tower Semiconductor's 0.13-Micron Process
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |