AMCC and Redpine Signals Collaborate on Next Generation Power Architecture-Based Embedded Wi-Fi Connectivity Solutions
SAN JOSE, Calif., April 14, 2008-- Embedded Systems Conference -- Redpine Signals, Inc., a leading developer of ultra low power multi-standard OFDM and MIMO silicon-based solutions, and Applied Micro Circuits Corporation (Nasdaq: AMCC - News), a global leader in embedded Power Architecture(TM) processing, optical transport and storage solutions, today announced the successful integration of Redpine's Lite-Fi(TM) 802.11n silicon solution on AMCC's PowerPC® 405EXr evaluation platform. The combination of Redpine's Lite-Fi(TM) and AMCC's PowerPC 405EXr enables a variety of embedded solutions that incorporate single-antenna ultra low power 802.11n connectivity at a lower cost than current 802.11b/g solutions. The partnership between Redpine Signals and AMCC also focuses on creating solutions for multi-antenna 3x3 802.11n-enabled systems such as enterprise access points (AP), routers and gateways that incorporate Redpine's MIMO 802.11n technology with an AMCC PowerPC 405EX processor.
Redpine's Lite-Fi product family offers differentiating performance and power advantages achieved through six years of research and multiple patents in all the relevant areas of architecture, signal processing, algorithms and low-power implementation. "Lite-Fi's interfaces and architecture are optimized for connectivity to embedded processors such as AMCC's PPC 405EX and EXr processors with minimal host overhead," said Mr. Venkat Mattela, Chief Executive Officer of Redpine Signals Inc. "Our partnership with AMCC forges complementary pieces of leading technology into consumer and enterprise products that stand out in functionality and performance," he said.
The PowerPC 405EXr, based on Power Architecture technology, is a price and performance optimized embedded processor for wireless access platforms including Wi-Fi access points, residential gateways and advanced set-top boxes. The 405EXr processor's scalability and rich feature set, including PCI Express and Gigabit Ethernet interfaces as well as USB2.0 On-The-Go and an integrated security engine that supports IPSec and SSL, provide for an ideal solution for current and emerging WLAN and WiMAX applications.
"The high level of integration in the PowerPC 405EXr reduces the external components required for next generation WLAN access designs, which drastically reduces system complexity and bill of material cost. The result is faster time-to-market and lower cost products," said Sam Fuller, Vice President Marketing at AMCC. "In particular, the 405EX and Redpine's Lite-Fi combine to provide an attractive platform for low cost and low power WLAN client applications such as wirelessly accessed printer servers and storage devices," he added.
The jointly developed solution for wireless client applications interfaces the Lite-Fi SoC to the 405EXr through a high-speed parallel interface, with a close-to-zero load WLAN driver on the PowerPC host. Lite-Fi incorporates a proprietary ultra low power multi-threaded layer-2 processor that not only provides a unique degree of protocol handling within the silicon but also provides power-efficient hardware offload of some critical layer-3 functionality, such as TCP checksum and security processing.
Redpine Signals and AMCC will display the joint solution at the Embedded System Conference in San Jose (CA) from 4/15 to 4/17 in AMCC's booth (#2010).
Wi-Fi CERTIFIED(TM)
Redpine's Lite-Fi(TM) solution is Wi-Fi CERTIFIED for 802.11n draft 2.0 by the Wi-Fi Alliance.
"802.11n draft 2.0 is an advanced standard for delivering increased throughput, improved range and Quality of Service (QoS) for enhanced multimedia capabilities. In achieving Wi-Fi CERTIFIED for 802.11n draft 2.0, Redpine Signals has demonstrated its commitment to ensuring industry interoperability and the best experience for Wi-Fi users," said Wi-Fi Alliance Senior Director, Karen Hanley.
A searchable Wi-Fi CERTIFIED products database is available at http://www.wi-fi.org.
About Redpine Signals, Inc.
Founded in 2001, Redpine Signals is a fabless semiconductor company driving Wi-Fi® +WiMAX® convergence products for mobile, consumer and enterprise applications with sustainable differentiation in power and performance. Using its extensive patent portfolio in ultra low power OFDM and MIMO technologies, Redpine is making wireless convergence a reality.
Redpine is headquartered in San Jose, California with a development center in Hyderabad, India.
About AMCC
AMCC provides leadership semiconductor solutions to process, transport, and store digital information for the world's wired and wireless networks. As a leading supplier of Power Architecture(TM) based processors and with world-class expertise in SONET and Ethernet protocol processing and PHY technology and Storage processors and RAID controllers, our products are the foundation of the IP Communications Revolution. AMCC's 3ware SAS and SATA RAID controllers deliver cost-effective, high-performance, high-capacity storage for enterprises and consumers worldwide in applications like disk-to-disk backup, near-line storage, network-attached storage (NAS), video, and high-performance computing. For further information regarding AMCC, please visit our website at http://www.amcc.com.
|
Related News
- Cypress and Redpine Signals Collaborate to Provide Low-Power 802.11n Wi-Fi® I/O Connectivity for PSoC® 3 and PSoC 5 Platforms
- Conexant Expands Low-Power Wi-Fi Portfolio with New Platform for Embedded Applications
- Atmel and Redpine Signals Collaborate to Provide Ultra-Low-Power 802.11n Wi-Fi Capability for AVR and ARM-based Microcontrollers
- LTRIM PowerTrimPaK Streamlines Power Management for Bluetooth/Wi-Fi Devices
- Agere Systems and Ubicom Collaborate on Multimode Wi-Fi Reference Designs with Routing Speeds Up to Three Times Faster Than Competing Solutions
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |