MoSys, Virage develop next-generation memory compilers for TSMC processes
MoSys, Virage develop next-generation memory compilers for TSMC processes
By Semiconductor Business News
February 29, 2000 (9:34 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000229S0004
SUNNYVALE, Calif. -- MoSys Inc. here and nearby Virage Logic Corp. today announced a partnership to develop fourth-generation memory compilers for 0.18- and 0.15-micron logic processes offered by Taiwan Semiconductor Manufacturing Co. Ltd. The new memory compilers will be based on MoSys' single-transistor SRAM technology--called 1T-SRAM--and Virage's Custom-Touch compiler. The goal is to create compilers for extremely high-density memory blocks that are embedded in system-on-chip designs for TSMC's new standard logic processes. The compilers will employ "what-if-analysis" and performance trade-off capabilities early in the design cycle to help speed SoC development, said the two Silicon Valley partners. "Custom-Touch 1T-SRAM compilers for our leading 0.15- and 0.18-micron processes gives customers easy access to high capacity memory required in these designs," Roger Fisher, senior director and corporate marketing at TSMC. The first Custom-T ouch 1T-SRAM compiler is scheduled to become available in the second quarter of 2000. "The MoSys-Virage partnership is committed to proliferating this unique memory technology to enhance productivity and enable system designers to make smart technical decisions without making any unnecessary compromises," said Vin Ratford, vice president of marketing and sales at Virage, based in Fremont, Calif. "For the first time the performance benefits of SRAM and density advantages of DRAM can be combined in a compilable form."
Related News
- Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America
- ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC
- ADTechnology and Zaram Technology to develop the next-generation of telecommunications semiconductor chips
- Cadence Advances Hyperscale SoC Design with Expanded IP Portfolio for TSMC N3E Process Featuring Next-Generation 224G-LR SerDes IP
- Infineon's HYPERRAMâ„¢ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |