Xilinx Adds Flexible Connectivity to Low-Power Intel(R) In-Vehicle Infotainment Reference Design
Xilinx Automotive FPGA and connectivity solution enables scalable, flexible infrastructure for rapid infotainment system development
SAN JOSE, Calif. -- May 21, 2008 -- Xilinx, Inc. (Nasdaq: XLNX) today announced availability of an integrated Xilinx(R) Automotive (XA) field programmable gate array (FPGA) and intellectual property (IP) solution that is included in the Low-Power Intel(R) In-Vehicle Infotainment Reference Design (Low-Power Intel(R) IVI Reference Design) targeting automotive head units. The combination of the XA solution and Intel(R) Atom(TM) processor in the design provides system developers with improved levels of performance, scalability, and flexibility when developing open infotainment platforms. Demonstrations of the platform will debut at Telematics Detroit 2008 taking place on May 21-22, at the Rock Financial Showplace in Novi, Michigan.
This collaboration by Xilinx and Intel -- and their respective ecosystem suppliers -- addresses the growing demand for in-vehicle access to digital information and entertainment on par with what consumers have come to expect in their homes and offices. As a member of the Intel(R) Embedded and Communications Alliance, Xilinx works with Intel to provide mutual customers with complete, flexible automotive solutions that accelerate system development. This latest development effort couples the inherent flexibility and built-in connectivity capabilities of XA Spartan(R)-3 generation FPGAs with the high performance, low power processing and surrounding ecosystem of the Intel(R) Atom(TM) processor Z530 and Intel(R) System Controller Hub US15W.
Robust Development Platform
The Low-Power Intel IVI Reference Design utilizes the XA Spartan-3E FPGA-based solution to extend the platform's flexibility and integrate many automotive-specific functions, such as video capture support and MOST(R) network connectivity. The available solution incorporates multiple functions including SD 2.0 (including SDHC), Video frame grabber for camera inputs, Bluetooth connectivity, Low Pin Count interface for BIOS configuration, MOST connectivity with the LogiCORE(TM) NIC IP for MOST or Media Local Bus supporting an external network controller and Flash memory interface. These capabilities are geared for embedded systems within the vehicle central console, which typically encompasses navigation, entertainment, and Bluetooth wireless connectivity to portable devices.
The XA Spartan-3E FPGAs are delivered as part of Xilinx 'end-to-end' automotive solutions developed in collaboration with multiple leading automotive market members of the Xilinx Alliance program. XA solutions integrate the hardware and software components, including pre-verified Xilinx and third-party application-optimized IP building blocks, required to implement full-featured automotive subsystems that include vehicle networking based on MOST, FlexRay and CAN industry standards. In addition, XA programmable devices give developers optimal architectural flexibility with the ability to determine system partitioning and target multiple end user specifications. This contrasts the limitations imposed on product development by the pre-defined architectures and features of existing application-specific standard part (ASSP) implementations.
Nick DiFiore, senior manager, Automotive System Architecture & Solutions at Xilinx added, "We're pleased to share our automotive industry experience and collaborate with Intel in this high growth sector. Together, we bring the compelling advantages of a high performance, low power programmable infrastructure to the development of infotainment systems. By building the flexible connectivity of our XA Spartan-3E devices into the ecosystem surrounding the Intel(R) Atom(TM) processor, developers are now even better equipped to differentiate their offerings for next-generation applications."
"Intel works with an extensive ecosystem of hardware and software vendors to provide the automotive industry with a range of development and design options," said Ton Steenman, vice president, Digital Enterprise Group and general manager, Low-Power Embedded Products Division. "The Low-Power Intel(R) IVI Reference Design demonstrates how we can enable our automotive customers to quickly bring solutions to market by working closely with our ecosystem. The integration of Xilinx XA FPGAs within the reference design proves how we can deliver a robust development platform with the flexibility and scalability needed to meet the growing complexity of infotainment system requirements."
Availability
The XA Spartan-3E FPGA-based companion chip solution for the Low-Power Intel IVI Reference Design will be available in July 2008. For more information, visit http://www.xilinx.com/automotive/infotainment. For more information on the reference design, visit http://www.intel.com/go/infotainment.
About XA Spartan-3E FPGAs
The XA Spartan-3E FPGA family is tested to meet the needs of high-volume, cost-sensitive automotive electronics applications. The five-member family offers densities ranging from 100,000 to 1.6 million-system gates with various package options. XA devices are available in both extended-temperature Q-Grade (-40 degrees C to +125 degrees C Tj) and I-Grade (-40 degrees C to +100 degrees C Tj) and are qualified to the industry-recognized AEC-Q100 standard. These 90-nm devices deliver more functionality and I/O bandwidth per dollar than previously possible, setting new standards in the programmable logic industry. Because of their exceptionally low cost, XA Spartan-3E FPGAs offer a superior alternative to the high mask costs and lengthy development cycles of ASICs and ASSPs.
About Xilinx Automotive Solutions
Xilinx is the automotive programmable logic device market leader with its Xilinx Automotive (XA) line of FPGAs and CPLDs tested to the AEC-Q100 automotive qualification standard. Xilinx also offers full automotive solutions that include LogiCORE(TM) and AllianceCORE IP cores, operating systems, middleware, software, and development boards. For more information about Xilinx automotive solutions, visit: http://www.xilinx.com/automotive.
About Xilinx
Xilinx is the worldwide leader in complete programmable logic solutions. For more information, visit http://www.xilinx.com.
|
Xilinx, Inc. Hot IP
Related News
- Xilinx Spartan-6 FPGAs Enable PCI Express Compliant System Design for Low-Power, Low-Cost Connectivity Applications
- New Xilinx Spartan-6 FPGA Family Brings Low-Power and High-Speed Connectivity to Cost-Sensitive Electronic Systems
- MIPI A-PHY Specification Levels Up In-Vehicle Connectivity
- Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire RISC-V SoC FPGA for Embedded Vision Applications at the Edge
- Lattice Semiconductor Delivers Flexible Connectivity for Industrial Vision Applications with New CrossLink Reference Design
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |