2.5D GPU / 2D & 3D Vector Graphics (OpenVG) Accelerator - D/AVE HD
OCP-IP Releases OCP 2.2 Revision A
OCP has a wide range of configuration parameters that place it in a unique position to be easily optimized to fit the varying demands of most all IP cores and systems. Should the parameterization of the master and slave interfaces not match, the protocol defines a set of rules that both ensure interoperability and describes behavioral restrictions on the master and/or slave to facilitate interoperability. When the interface parameterization differs sufficiently that key master or slave functionality is not supported by the other side, protocol conversion via a simple bridge might occasionally be required. If IP cores are inconsistent and separated by a shared interconnect, it is sometimes a role of the interconnect to provide this protocol conversion. Alternatively, system companies have defined their own internal consensus profiles that provide company engineers with standardized configurations of OCP options for specific system use cases, ensuring interoperability without conversion.
Initial definition work on the consensus profiles began when Nokia, Texas Instruments and Toshiba exchanged their internal OCP profiles. Once an agreement was achieved between these three companies, these new profiles were finalized in the OCP-IP Specification Working Group which includes representatives from MIPS, Sonics, and STMicroelectronics.
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP), formed in 2001, promotes and supports the Open Core Protocol (OCP) as the complete socket standard ensuring rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants include: Nokia (NYSE:NOK), Sonics Inc., Synopsys (SNPS), Texas Instruments (NYSE:TXN), and Toshiba Semiconductor Group (including Toshiba America TAEC). OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed, core-centric protocol comprehensively fulfilling system-level integration requirements. The OCP facilitates IP core reusability and reduces design time, risk, and manufacturing costs for SoC designs. For additional background and membership information, visit www.OCPIP.org.
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