eASIC zooms past 100th
90nm ASIC design win in 18 months
Santa Clara, CA – June 2, 2008 – eASIC Corporation, a provider of zero mask-charge ASIC devices, today announced that it has surpassed 100 design wins in only 18 months for it’s Nextreme family of 90nm ASIC devices. These design wins demonstrate rapid adoption into both mature and emerging markets including digital consumer, telecommunication infrastructure, wireless, medical, video surveillance and broadcast. eASIC's Nextreme family of zero mask-charge and no minimum order ASIC devices, combines the low cost benefits of traditional ASIC devices with a rapid design cycle and only a four week silicon turnaround time.
“eASIC’s Nextreme devices offered us the only solution to meet the stringent cost, performance and power requirements for our consumer digital video products,” said Sunny Ng, Vice President of Engineering at Aurora Systems. “We were extremely impressed with the fast turnaround time and low up front cost. I am not surprised that eASIC has rapidly reached this impressive milestone. We are privileged to be the recipient of the 100th Design Win award.”
Traditional ASIC technologies have suffered a dramatic decrease in design starts over the past ten years. From over 10,000 annual designs a decade ago, traditional ASICs now claim less than 4,000 designs annually. Industry analysts expect multi-million dollar NRE charges for traditional ASICs to continue to erode this segment of the market.
“The cost of traditional ASIC customization became prohibitive for the majority of applications and designers. eASIC’s zero mask-charge Nextreme devices have changed that landscape,” said Ronnie Vasishta, President and CEO of eASIC. “This milestone demonstrates that customers have embraced Nextreme ASIC as the vehicle for affordable silicon customization. Our wide variety of customers include fabless semiconductor companies, IDMs and system OEMs. 30 percent of these design wins are from multinational, publicly traded companies.”
About eASIC
eASIC is a fabless semiconductor company offering breakthrough zero mask-charge ASIC devices aimed at dramatically reducing the overall cost and time-to-production of customized semiconductor devices. Low-cost, high-performance and fast-turn ASIC and System-on-Chip designs are enabled through patented technology utilizing Via-layer customizable routing. This innovative fabric allows eASIC to offer ASICs with no mask-charges and no minimum order quantity,
Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Advanced Equities Incorporated and Evergreen Partners. For more information, please visit www.eASIC.com
|
Related News
- eASIC Delivers 45nm Zero Mask-Charge New ASIC Family
- eASIC and Tensilica Partnership Delivers Free Diamond Processors on Free Mask Charge ASICs
- eASIC and GenCore Form Partnership for Distribution of Nextreme Structured ASIC Devices in Korea
- Zero ASIC launches world's first open standard eFPGA product
- Zero ASIC Democratizing Chip Making
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |