Faster USB on track for introduction this year
Faster USB on track for introduction this year
By David Lammers, EE Times
February 18, 2000 (11:10 a.m. EST)
URL: http://www.eetimes.com/story/OEG20000218S0010
PALM SPRINGS, Calif. Version 2.0 of the Universal Serial Bus is on track for introduction by the Christmas 2000 selling season, according to Intel executives speaking at the Intel Developer Forum this week. The latest rev of the USB spec will support data-transfer rates of 480 Mbits/second for peripherals connected to a system. In a keynote address here, Pat Gelsinger, general manager of the Intel desktop products group (Hillsborough, Ore.), demonstrated a USB 2.0 connection to a flatbed scanner, based on controller and transceiver ICs implemented in FPGAs. Jason Ziller, a technology initiatives manager for Intel (Santa Clara, Calif.), said the 0.9 version of the USB 2.0 specification was released in December and will soon go out for a 30-day industry review. The final spec should be available on the USB Implementers Forum Web site in April. USB 2.0 is about 40 times faster than the USB 1.1 specifica tion. With data rates of 60 Mbytes/s, transfers that previously took five minutes will take less than 10 seconds, Ziller said. The higher bandwidth will enable applications such as interactive games and digital image creation, and will be used in videoconferencing cameras, scanners, printers, external storage, and broadband Internet connections. The 2.0 spec calls for the same cables and connectors used in the 1.1 standard, but the voltage swing in the controllers will be reduced from 3.3 volts in version 1.1 USB chip sets to 400 millivolts in version 2.0 chips. Also, dual termination is required on both ends of the wire, he said.
Related News
- Xilinx Reaches Industry Milestone with Record-Fast 28nm Product Rollout: $1B in Design Wins, Thousands of Device Shipments in First Year of Introduction
- SuperSpeed USB-Enabled Device Shipments on Fast Track to 1 Billion in 2014
- Linaro completes first year with demonstrations of Linaro Evaluation Builds for Android and Ubuntu and introduction of new partner program
- Sonics on Track to Reach One Billion Units by Year End
- Enhanced Zatara(TM) ARM(R)-Based ASSP From Zilog Adds Integrated Security Features, On-Chip USB for Reduced BOM Costs and Faster Time-to-Market
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |