Imperas Announces Licensing, Distribution Relationship with Tensilica

Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)

Tensilica Move Adds to Growing Open Virtual Platform Momentum

Thame, U.K. -- June 12, 2008 -- Tensilica, Inc. has signed a partnership agreement with Imperas to allow fast functional, instruction accurate models of its popular Xtensa and Diamond Standard processors to run on Open Virtual Platform (OVP) based virtual platforms. Specifically, wrapper files enabling integration of the Tensilica processor models are now available for free download from the OVPworld.org website. These models will run with Tensilica’s TurboXim™ fast functional simulator, which simulates at speeds 40 to 80 times faster than a traditional instruction set simulator.

This expands OVP’s library of free downloadable components. Imperas’s OVP wrappers for Tensilica cores use the built-in application programming interface (API) in the Tensilica simulation model for communication between the Tensilica processor model and the OVP platform. While models of Tensilica’s Xtensa configurable processor are automatically generated to match the exact configuration, models of Diamond Standard Series processors are available as part of a free 15-day software development kit evaluation download at www.tensilica.com.

“Our agreement with OVP and Imperas will help expand the market,” affirms Chris Jones, Tensilica’s director of strategic alliances. “Broadening the choices of ESL tools that our customers can use enables those designers to make better SOC architectural choices earlier in the design process. Open source, non-proprietary tools, such as those available from OVP, become important components for the growth of multicore design.”

The wrapper file is available now and downloadable free of charge at the OVP website: www.OVPworld.org.

Imperas Ltd. launched the OVP initiative in March 2008 with support from end users, intellectual property (IP) developers, service providers and tool suppliers. “In the three months since the launch of OVP over 250 people have registered on the OVP discussion forum, and over 100 unique companies and institutions have downloaded nearly 1000 OVP files,” says Simon Davidmann, CEO of Imperas. “This is an unprecedented launch in this industry, and this partnership with Tensilica is a significant addition to the OVP momentum.”

Other components available from OVP include APIs for building a platform verification infrastructure and developing behavioral and processor models. Model libraries of processors, behavioral components and peripherals are offered, along with platform templates, and OVPsim, a reference simulator shipped as an executable.

Imperas will be in booth #467 during the 45 Design Automation Conference (DAC) June 9-12 at the Anaheim Convention Center in Anaheim, Calif.

Open Virtual Platforms

The goal of OVP is to provide the infrastructure technology –– open source and free, focused on multicore and speed –– for embedded software development, and the infrastructure through the OVPworld.org website for this community to grow. The technology helps to address problems embedded software developers have when modeling the system on chip (SoC) that hosts their software.

The OVP website (www.OVPworld.org) serves as the portal, with details about the technology, a discussion forum for the community, and links to download each component.

About Imperas

Imperas is focused on delivering technology in the Electronic Design Automation (EDA) space. By blending hardware and software technologies and design processes together, Imperas provides methodologies, technologies and products to enable the efficient programming, debug, and verification of Multiprocessor Systems-on-Chip (MPSoCs). With an engineering base in the UK, Imperas distributes its products to customers worldwide. For more information, visit: www.imperas.com.

About OVP

Open Virtual Platforms (OVP) was initiated with the donation by Imperas of approximately $4 million of simulation infrastructure that enables chip designers and software developers to model platforms, systems on chips (SoCs), and multiprocessor SoCs (MPSoCs). The OVP technology is available for free from www.OVPworld.org and has the support of electronic design automation (EDA) companies, end users and intellectual property (IP) providers. For more details, visit: www.OVPworld.org.

About Tensilica

Tensilica offers the broadest line of controller, CPU and specialty audio and video DSP processors on the market today, in both an off-the-shelf format via the Diamond Standard Series cores and with full designer configurability with the Xtensa processor family. Tensilica's low-power, benchmark-proven processors have been designed into high-volume products at industry leaders in the digital consumer, networking and telecommunications markets. All Tensilica processor cores are complete with a matching software development tool environment, portfolio of system simulation models, and hardware implementation tool support. For more information on Tensilica's patented approach to the creation of application-specific building blocks for SOC design, visit www.tensilica.com.