TSMC Material Information
“According to our current estimates, TSMC’s second-quarter revenue, gross profit margin, and operating profit margin are all in line with or slightly higher than guidance announced at the end of April,” said Lora Ho, TSMC’s spokesperson and Chief Financial Officer. “Third quarter revenue is expected to grow from the second quarter, while gross profit margin and operating profit margin are expected to maintain second-quarter levels. In addition, TSMC maintains its forecast of approximately 5 percent growth in semiconductor industry revenues this year.”
In addition, TSMC announced a share buyback program on May 13 as part of a plan to facilitate Philips’ orderly exit from its shareholding in TSMC. The announced program stated that TSMC would repurchase its own common shares from the open market between May 14 and July 13, 2008, and cancel the repurchased shares.
In order to distribute the dividend approved at the Company’s June 13 shareholder meeting in a timely fashion, TSMC set July 22 as the 2008 dividend record date, and notified the Taiwan Stock Exchange of the ex-dividend date on July 1 in accordance with exchange regulations. As required by the Taiwan Securities and Future Bureau, a company may not repurchase shares between the announcement of its ex-dividend date and two days before the shareholders’ register is closed. Due to this requirement, TSMC could not carry out further share buybacks beginning July 1. At the same time, Philips also ceased selling TSMC shares beginning July 1.
According to TSMC and Philips’ consensus, Philips will not conduct any future sales of TSMC shares on the open market without the agreement of TSMC.
|
Related News
- TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
- GUC Announces Successful Launch of Industry's First 32G UCIe Silicon on TSMC 3nm and CoWoS Technology
- TSMC Intends to Expand Its Investment in the United States to US$165 Billion to Power the Future of AI
- Dolphin Semiconductor Provides High-Performance LDO Regulators in TSMC 22nm to Ingenic for IPC Applications
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |