CEVA Extends Worldwide Leadership in DSP Licensing
Leading research firm Gartner reports CEVA's share of the worldwide Digital Signal Processor design licensing market at 61%
SAN JOSE, Calif. -- July 8, 2008 -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that it has been ranked by Gartner, Inc. as the worldwide leader in licensable DSP technology, commanding over 60% of the 2007 Digital Signal Processor licensing market. Gartner's report: Market Share: Semiconductor Intellectual Property, Worldwide, 2007(1), reports that CEVA's overall DSP licensing market share has grown 10% year on year, increasing CEVA's industry leadership over the competition.
CEVA believes that its strong performance reflects the Company's continued success in licensing DSP cores and subsystems to the industry's leading semiconductor and consumer electronics companies. Licensing DSPs for over a decade and spanning six generations of DSP cores, CEVA has concluded more than 250 licensing agreements to date. Today, CEVA's publicly announced customer base includes Broadcom, Infineon, InterDigital, Marvell, Mediatek, Mindspeed, NXP, RadioFrame Networks, Renesas, Samsung, Sharp, Sony, Spreadtrum and Zoran. In 2007, CEVA's customers shipped over 225 million CEVA-powered™ devices to the wireless handset, automotive, consumer electronics and storage markets.
"CEVA is pleased to be ranked by Gartner as the worldwide leader in licensable DSP technology," said Gideon Wertheizer, CEO of CEVA. "We believe our clear leadership is a testament to our relentless commitment to deliver the industry's most extensive portfolio of DSP cores and related technologies. Our strong customer base coupled with tier 1 OEM adoption of our technology allows us to extend our market reach and grow the business to applications where DSP IP has yet to be used."
1) Gartner, Inc. "Market Share: Semiconductor Intellectual Property, Worldwide, 2007" by Ganesh Ramamoorthy and Christian Heidarson, May 15, 2008
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, consumer electronics and storage markets. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2007, CEVA's IP was shipped in over 225 million devices. For more information, visit http://www.ceva-dsp.com/
|
Ceva, Inc. Hot IP
Related News
- CEVA Extends its Leadership in High Performance Scalable Sensor Hub DSPs with 2nd Generation SensPro Family
- Ceva Extends its Smart Edge IP Leadership, Adding New TinyML Optimized NPUs for AIoT Devices to Enable Edge AI Everywhere
- CEVA Extends its Leadership in NB-IoT IP with CEVA-Dragonfly NB2, the World's First eNB-IoT Rel14 Solution
- CEVA to Showcase Leadership in Mobile DSP Technologies for Advanced Communication and Multimedia Applications at Mobile World Congress 2012
- New Power Architecture Silicon Roadmap Signals Strong Growth in Existing and New Markets as Power Architecture Technology Extends Its #1 Worldwide 32-bit MPU and 32-bit CPU Market Share Leadership through 2009
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
E-mail This Article | Printer-Friendly Page |