Video: Global Unichip races to 32-nm designs
(07/08/2008 7:53 PM EDT)
Mark LaPedus, semiconductor editor from EE Times, caught up with Jim Lai, president and COO of Global Unichip Corp. The Hsinchu, Taiwan-based company claims to be the world's largest fabless ASIC vendor, with sales of $215.5 million in 2007. In 2006, the company had $103 million in sales.
Global Unichip works hand-in-hand with its largest shareholder, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). Global Unichip provides various ASIC and IC design services. The devices in turn are produced in TSMC's fabs.
During a video interview, Lai discusses the trends in the ASIC industry, Global Unichip's strategy and the company's push to get a 32-nm test chip out the door by year's end.
Related News
- Global Unichip Corporation Uses Cadence Digital Implementation and Signoff Flow to Deliver Advanced-Node Designs for AI and HPC Applications
- ARC and Global Unichip Partner to Speed Digital Audio System-on-Chip Designs For Greater China's Semiconductor Industry
- Global Unichip Collaborates With Cadence and Kilopass to Deliver Innovative Consumer Entertainment Designs
- Global Unichip Corporation Deploys Cadence Clarity 3D Solver to Achieve 5X Speedup of Systems Analysis for 112G Long-Reach Network Switch
- Global Unichip Corporation and Flex Logix Achieve First-Time Working Silicon on Joint ASIC Development Using EFLX Embedded FPGA (eFPGA) IP
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |