Actel Achieves Rigorous ISO/TS16949 Automotive Quality Management System Certification
Raises the Bar for Low-Power FPGAs In High-Reliability Automotive Applications
MOUNTAIN VIEW, Calif. -- July 15, 2008 — Giving automotive manufacturers the confidence they need to embed field-programmable gate arrays (FPGAs) in system-critical automotive applications, Actel Corporation (NASDAQ: ACTL) today announced it has received ISO/TS 16949:2002 certification. When combined with AEC-Q100 Grade 1 and Grade 2 qualification of its ProASIC®3 devices and the company's Production Part Approval Process (PPAP) documentation, the new certification ensures that customers can deploy the highest grade automotive low-power FPGA product on the market and confirms that the company's design, development and production procedures meet the standard's strict guidelines.
"Certification is a mandatory requirement for doing business with the majority of automotive manufacturers," said Terry Pence, senior manager, high-reliability product marketing, for Actel. "This important ISO certification ensures that our quality management system follows best practices for the automotive industry and provides a process for continual improvement. By satisfying the automotive industry's stringent requirements, we ensure that our products are well-suited for the extreme conditions presented by under-the-hood, safety and body electronics applications."
Actel FPGAs: Designed for Reliability
Actel's flash-based FPGA devices offer the industry's lowest power and critical firm error immunity levels not achieved by SRAM-based solutions. This allows a wide variety of transportation vehicles—from standard automobiles to trucks and locomotives—to leverage the flexibility, performance and overall lower program costs of using FPGAs in high-reliability applications. To date, more than 70 percent of the company's automotive-grade, flash-based devices are used in "under-the-hood" applications such as powertrain, safety and transmission control modules.
Last year, Actel announced that the ProASIC3 family was the first to achieve AEC-Q100 Grade 1 and Grade 2 qualification, making them the first FPGAs to achieve this quality level. Qualification verifies that ProASIC3 devices can operate in extended junction temperature ranges (-40 to +135°C). Ultra low static power of 40 mA at 135°C enables the devices to endure extreme temperatures for longer periods of time without thermal reliability or runaway concerns.
The ProASIC3 family also uniquely features on-chip flash memory for FPGA switch control, making them immune to neutron-induced firm errors which can cause configuration upsets—a mandatory requirement in an industry driving toward zero defects. Actel's automotive-grade products therefore provide the first viable alternative to complex and costly application-specific integrated circuit (ASIC) technology in under-the-hood applications.
About Actel
Attacking power consumption from both the chip and the system levels, Actel Corporation's innovative FPGAs and programmable system chip solutions enable power-efficient design. The company is traded on the NASDAQ National Market under the symbol ACTL and is headquartered at 2061 Stierlin Court, Mountain View, Calif., 94043-4655. For more information about Actel, visit http://www.actel.com.
|
Microsemi Hot IP
Related News
- Mixel Achieves ISO 26262 for Automotive Functional Safety and ISO 9001 Certification for IP Quality Management System
- Jazz Semiconductor Achieves ISO/TS 16949 Automotive Quality Management System Certification
- Attopsemi Achieves ISO 9001 Certification for IP Quality Management System
- Synopsys Achieves ISO 9001 Certification for IP Quality Management System
- Creonic's Quality Management System Achieves ISO 9001:2015 Certification
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |