TranSwitch Announces a Technology License Agreement for Its 3.5G HDMI 1.3 PHY IP Core
“The need for high throughput in the HDMI market stems from the demand for higher resolutions and increased color depth. New high-end TVs have already started to adopt 10 bits per color (30 bit per pixel), going to 12 bits and later 16 bits per color. The speeds of existing HDMI PHYs in the market go up to 2.25Gbps/channel and these can not meet the emerging requirements of the industry. TranSwitch is the first provider in the market for HDMI PHYs, capable of running at 3.5Gbps which is the full speed of the HDMI 1.3 standard,” said Mr. Amir Bar-Niv, Vice President for Systems and Applications at TranSwitch Corporation.
The HD-PXL™-1.3 transmitter IP core is available in two versions. The first version meets all the current HD (High Definition) standards up to 2.25 Gbps. The second version supports serial communications at a speed of up to 3.5 Gbps per channel for extended HD resolutions, with backward compatibility to the first version of 2.25 Gbps.
The transmitter IP core and the DSP-based receiver IP core can run at aggregated speeds of up to 10.5 Gbps and support color depth of up to 16 bits, while providing low power consumption and small die size.
The TranSwitch PHY cores have the added advantage that they incorporate a unique set of features, called SI UpswingTM that enhances the control on signal integrity, which is required for data rates above 2.5 Gbps. The transmitter has features for amplitude control, slope control, and pre-emphasis control as well as internal line termination. The company also licenses an HDMI 1.3 receiver core that has some unique features including an adaptive equalizer with an accelerated adaptation mechanism, allowing the use of a wide spectrum of cables, connectors, and speeds.
TranSwitch provides a comprehensive package of deliverables to assist customers through all phases of development, design integration and manufacturing of their SoC. This package includes a development platform, as well as all documentation and models of the IP, which allows customers to easily integrate the HD-PXL-1.3 IP cores into complex SoC designs so they can get to market more quickly. TranSwitch's roadmap in this area includes offering these cores in 65 nm technology by the end of 2008 and other products including offerings for DisplayPort as market demands evolve.
About TranSwitch
TranSwitch Corporation designs, develops and markets innovative semiconductors and technology that provide core functionality and complete solutions for voice, data and video communications network equipment.
As a leading supplier to telecom, datacom, cable television and wireless markets, TranSwitch customers include the major OEMs that serve the worldwide public network, the Internet, and corporate Wide Area Networks (WANs). TranSwitch devices are inherently flexible; many incorporating embedded programmable microcontrollers to rapidly meet customers’ new requirements or evolving network standards by modifying a function via software instruction. TranSwitch implements global communications standards in its VLSI solutions and is committed to providing high-quality products and services. TranSwitch, Shelton, CT, is an ISO 9001:2000 registered company. For more information, visit www.transwitch.com.
|
Related News
- TranSwitch announces first HDMI 1.3 PHY IP Core operating at 10.5 Gbps
- Anchor Bay Offers New Low-Cost HDMI 1.3 Deep Color Video-Processing IC for Blu-ray Players and AV Receivers
- Silicon Image Supplies Samsung With HDMI 1.3 Transmitter for Blue-Ray Disc Player and HDMI 1.3 Receiver and Switches for HDTVSs
- Silicon Image Unveils a New Line of Integrated HDMI 1.3 Input Processors for HDTVs
- HDMI 1.3 Doubles Bandwidth, Delivers Billions of Colors for HDTVs
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |