English
UMC's Embedded DRAM, URAM(TM) Proven in 65nm Customer Silicon
Pure-Play Foundry Industry's Only Proprietary Embedded DRAM Solution Enables Performance, Size and Cost Advantages for SoC Products
HSINCHU, Taiwan -- August 4, 2008 -- UMC, a leading global semiconductor foundry, today announced that it has produced functional 65nm customer products incorporating URAM, the company’s patented embedded DRAM (eDRAM) technology. URAM enables higher performance, lower power consumption, and reduced chip size compared to traditional embedded 6T SRAM or external DRAM. URAM, which is the only available proprietary embedded DRAM solution in the pure-play foundry industry, is already in production at UMC for 90nm customer products.
Raymond T. Leung, vice president of memory IP development at UMC, said, “The advanced products that power today’s digital economy require sophisticated technology solutions to satisfy the rigorous demands for lower power consumption, higher performance, and smaller form factor. UMC’s URAM effectively addresses the needs of SoC designs for a broad range of applications, including storage media, communications, and graphics and imaging systems, by providing a high-density memory that delivers up to a 50 percent area reduction over standard 6T SRAM.”
About UMC’s URAM
URAM’s ultra high density, 1/4 to 1/5 the size of 6T SRAM with a macro area of approximately 1/2 to 1/3 times the size of SRAM, allows for smaller overall form factor so that designers can fit more functions within a smaller chip area. Customers utilizing URAM on either UMC’s standard or low-leakage processes will be able to design for higher bandwidth, thus increasing operating speed while reducing power consumption due to fewer I/O drivers.
URAM’s logic process compatibility, scalable trench cell architecture and SRAM-like interface enable seamless integration into customer designs and existing IP. Since URAM is a proprietary UMC-developed technology, the foundry provides comprehensive, dynamic design support for customers utilizing URAM for their designs. For more information, please contact sales@umc.com.
About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced system-on-chip (SoC) designs for applications spanning every major sector of the IC industry. UMC’s SoC Solution Foundry strategy is based on the strength of the company’s advanced technologies, which include production proven 90nm, 65nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
HSINCHU, Taiwan -- August 4, 2008 -- UMC, a leading global semiconductor foundry, today announced that it has produced functional 65nm customer products incorporating URAM, the company’s patented embedded DRAM (eDRAM) technology. URAM enables higher performance, lower power consumption, and reduced chip size compared to traditional embedded 6T SRAM or external DRAM. URAM, which is the only available proprietary embedded DRAM solution in the pure-play foundry industry, is already in production at UMC for 90nm customer products.
Raymond T. Leung, vice president of memory IP development at UMC, said, “The advanced products that power today’s digital economy require sophisticated technology solutions to satisfy the rigorous demands for lower power consumption, higher performance, and smaller form factor. UMC’s URAM effectively addresses the needs of SoC designs for a broad range of applications, including storage media, communications, and graphics and imaging systems, by providing a high-density memory that delivers up to a 50 percent area reduction over standard 6T SRAM.”
About UMC’s URAM
URAM’s ultra high density, 1/4 to 1/5 the size of 6T SRAM with a macro area of approximately 1/2 to 1/3 times the size of SRAM, allows for smaller overall form factor so that designers can fit more functions within a smaller chip area. Customers utilizing URAM on either UMC’s standard or low-leakage processes will be able to design for higher bandwidth, thus increasing operating speed while reducing power consumption due to fewer I/O drivers.
URAM’s logic process compatibility, scalable trench cell architecture and SRAM-like interface enable seamless integration into customer designs and existing IP. Since URAM is a proprietary UMC-developed technology, the foundry provides comprehensive, dynamic design support for customers utilizing URAM for their designs. For more information, please contact sales@umc.com.
About UMC
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced system-on-chip (SoC) designs for applications spanning every major sector of the IC industry. UMC’s SoC Solution Foundry strategy is based on the strength of the company’s advanced technologies, which include production proven 90nm, 65nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 13,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.
|
||||||
Related News
- Virage Logic and ATMOS Corporation Launch Joint Sales of Silicon-Proven, Compiled Embedded DRAM in TSMC's Standard Logic Process
- Virage Logic First Semiconductor IP Vendor With Silicon Proven Memory on TSMC's 65nm GP Process
- Silicon Image to Port HDMI(TM) Receiver IP Core to UMC's 90nm Process Technology; IP Targets SoC Designs for High-Definition Media Applications
- IPCore introduces China's first silicon-proven embedded-OTP solution
- Faraday's USB 2.0 OTG High Speed IP Core Silicon Proven on UMC's 0.13 um Technology
Breaking News
- Achronix and BigCat Wireless Collaborate to Deliver Unprecedented Power Efficiency and Performance for 5G/6G Wireless Applications
- Renesas Unveils Industry's First Automotive Multi-Domain SoC Built with 3-nm Process Technology
- LG and Tenstorrent Expand Partnership to Enhance AI Chip Capabilities
- CHERI Alliance Officially Launches, Adds Major Partners including Google, to Tackle Cybersecurity Threats at the Hardware Level
- Silicon Creations Celebrates Milestone with Delivery of 1,000th Production License for Fractional-N PLL
Most Popular
- Flex Logix Acquired By Analog Devices
- Arteris and MIPS Partner on High-Performance RISC-V SoCs for Automotive, Datacenter and Edge AI
- NanoXplore acquires Dolphin Design's ASIC business and strengthens its strategic position in aerospace
- SEMIFIVE Collaborates with Synopsys to Develop Advanced Chiplet Platform for High-Performance Multi-Die Designs
- Imagination DXS GPU officially certified as ASIL-B compliant
|
E-mail This Article | 
|
|
Printer-Friendly Page |