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D&R Headline News (Last 14 Days)
Headlines for Friday Mar. 28, 2025
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intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
Leveraging intoPIX’s SMPTE ST 2110-22 JPEG XS technology, the IPX-100 now supports visually lossless video compression with imperceptible latency, making remote production over IP more efficient than ever. With selectable compression levels, users can optimize bandwidth usage while preserving image quality, allowing for seamless 4K/UHD transport over 1GbE or 10GbE networks.Headlines for Thursday Mar. 27, 2025
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Qualcomm initiates global anti-trust complaint about Arm
Qualcomm has initiated anti-competitive complaints against Arm in the US, Korea and Europe, reports Bloomberg.- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
- Faraday Technology Selects Silvaco FlexCAN IP for Advanced Automotive ASIC Design
Headlines for Wednesday Mar. 26, 2025
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intoPIX JPEG XS Cores Power Delta Video's IP Video Transmission Solutions
intoPIX has integrated its JPEG XS technology into Delta Digital Video’s 5480 Series Encoder and Decoder, enabling ultra-low latency and bandwidth-efficient IP video transmission.- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- EnSilica Opens Second Brazilian Design Centre Following Multimillion Pound Design and Manufacturing Contract Win
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- PolarFire® SoC FPGAs Achieve AEC-Q100 Qualification
Headlines for Tuesday Mar. 25, 2025
Latest News- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
Headlines for Monday Mar. 24, 2025
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EnSilica Agrees a Multimillion Pound Design and Manufacturing Services Contract
EnSilica is pleased to announce that it has been awarded a multimillion-pound design and manufacturing services contract by a well-funded pioneering optical computing systems company. The Contract includes substantial design services engagement and additional manufacturing services.- Strategies for Addressing More Complex Custom Chip Design
- M31 Technology - AI-Powered Automotive Dual Engines and 2nm Technology Boost Revenue to Record Highs
- Brite Semiconductor Releases DDR3/4, LPDDR3/4 Combo IP
- SoCs Get a Helping Hand from AI Platform FlexGen
- Accellera Announces IEEE Standard 1801™-2024 is Available Through IEEE GET Program
Headlines for Thursday Mar. 20, 2025
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SoftBank Group to Acquire Ampere Computing
SoftBank Group Corp. today announced that it will acquire Ampere® Computing, a leading independent silicon design company, in an all-cash transaction valued at $6.5 billion.- Zero ASIC launches world's first open standard eFPGA product
- Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
- Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications
- Synopsys Accelerates Chip Design with NVIDIA Grace Blackwell and AI to Speed Electronic Design Automation
- Cycuity Collaborates with SiFive and BAE Systems to Demonstrate Advanced Microelectronics Design Supply Chain Security
- Menta Unveils 'Launch Pad' Low-Cost Embedded FPGA (eFPGA) Technology Access Program For Defense And Aerospace Customers
Headlines for Wednesday Mar. 19, 2025
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Sofics and Dolphin Semiconductor Announce Strategic Partnership
Sofics, a leading provider of specialty I/O and on-chip electrostatic discharge (ESD) solutions, and Dolphin Semiconductor, a leading provider of semiconductor IP solutions specializing in mixed signal IP design, today announced a strategic partnership aimed at enhancing integrated circuit (IC) designs for customers in key sectors such as IoT, wireless, and automotive.- Comcores is now a member of the OPEN Alliance
- KiviCore and CAST Release Post-Quantum Cryptographic Key Encapsulation IP Core
Headlines for Tuesday Mar. 18, 2025
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Arteris Selected by Nextchip to Accelerate Chip Designs for Automotive Vision Technology
Arteris’ FlexNoC network-on-chip (NoC) interconnect IP with the Functional Safety option provides Nextchip with optimal flexibility and superior performance to advance automotive technology including vision-based sensing edge to central architecture for ADAS.Headlines for Monday Mar. 17, 2025
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SerDes Hard Macro IP in GlobalFoundries 22FDX - Available For Licensing and Implementation from Global IP Core
Global IP Core Sales – The largest IP Core portfolio on the Semiconductor market in the Aerospace & Defense, Satellite Communications and Telecommunications industry is providing the SerDes Hard Macro- IP in GlobalFoundries 22FDX to suit your product needs.- Cadence Joins Intel Foundry Accelerator Design Services Alliance
- China Bets on Homegrown Chip Tech With RISC-V Push
- The Case for Hardware-Assisted Verification in Complex SoCs
- TSMC and MediaTek Demonstrate First Integrated PMU and PA for Wireless Connectivity Products on N6RF+ Process Technology
- Andes Technology Achieves Record Annual Revenue Amid Strong AI Demand
- Automotive Ethernet PHY IP Core in 28nm with BroadR-Reach and 100BaseT1 Compatibility for Automotive Applications
Headlines for Friday Mar. 14, 2025
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InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications
The collaboration will bring InPsytech’s advanced IP offerings to the Intel Foundry ecosystem, enabling mutual customers to design their semiconductor products using Intel Foundry’s cutting-edge process technologies.Headlines for Thursday Mar. 13, 2025
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Intel's New CEO Called "Strong Choice" to Respin Company
Intel’s new CEO, Lip-Bu Tan, is a good choice to turn the struggling U.S. chipmaker around, according to analysts who spoke to EE Times.