Tensilica Collaborates with Cadence to Create CPF-Enabled Flow for Tensilica’s Multimedia Subsystems
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif. – September 9, 2008 – Tensilica, Inc. announced today that they have collaborated with Cadence (NASDAQ: CDNS) to create a Common Power Format (CPF)-enabled low-power reference design for a multimedia subsystem based upon its popular 330HiFi Audio Processor and 388VDO Video Engine. Cadence and Tensilica engineers worked together to develop an implementation of the Tensilica multiprocessor audio-video platform using the complete Cadence Low-Power Solution including Encounter RTL Compiler global synthesis, Encounter Conformal Low Power and the SoC Encounter RTL-to-GDSII system.The 388VDO Video Engine is a fully programmable codec processor that supports multi-standard, multi-resolution video. Both are targeted at mobile handsets and personal media players (PMPs). Now, SoC designers can now build upon the Tensilica reference design by employing the Cadence Low-Power Solution to deliver the lowest-power implementation for power-sensitive mobile applications.
“The combination of Tensilica IP with the Cadence Low-Power Solution equips customers with all the tools and technology they need to create power-efficient, portable multimedia chips,” stated Chris Jones, Tensilica’s director of strategic alliances. “By using this reference flow based on the widely deployed Common Power Format, our customers will be able to save precious design time while employing the most advanced techniques for low-power design.”
“Tensilica has been an active participant in the Power Forward Initiative which has the goal of enabling the design and production of more power-efficient electronic devices,” said Pankaj Mayor, group director of Business Enablement at Cadence Design Systems, Inc. “This proof point project demonstrates that by using CPF with the Tensilica processor and the Cadence Low-Power Solution, multimedia chip designers can accelerate delivery of ultra-low-power products to their markets.”
For 330HiFi and 388VDO users, Tensilica will deliver example reference scripts for Encounter RTL Compiler global synthesis, Encounter Conformal Low Power and the SoC Encounter RTL-to-GDSII system, along with example CPF files describing power intent for the 388VDO processor. The CPF package will be available in the fourth quarter of 2008.
About Tensilica
Tensilica, Inc., is the recognized leader in customizable applications processors, DSPs and standard IP cores for audio, video, imaging, security, networking, and baseband signal processing. The automated design tools behind all of Tensilica’s customizable applications processor cores powers top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica’s patented, benchmark-proven processors, visit www.tensilica.com.
|
Related News
- ARC Building Advanced CPF-Enabled Flow to Lower Power Consumption of its Configurable Subsystems and Cores
- Virage Logic Strengthens Low Power IP Product Portfolio with Availability of 65nm CPF-Enabled Ultra-Low-Power Standard Cell Libraries
- Rockley Photonics Collaborates with Cadence to Create a High-Performance System for Hyperscale Data Centers
- Cadence Collaborates with Arm and Samsung Foundry on Delivery of 5LPE Flow for Mission-Critical Applications Using Next-Generation "Hercules" CPU
- Cadence Full-Flow Digital and Signoff Tools and Custom/Analog Tools Certified and Enabled for Intel 22FFL Process Technology
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |