English
TSMC September 2008 Sales Report
Hsinchu, Taiwan, R.O.C. – October 9, 2008 - TSMC (TAIEX: 2330, NYSE: TSM) today announced its net sales for September 2008: on an unconsolidated basis, sales were NT$28,252 million, a decrease of 8.9 percent from August 2008 and a decrease of 0.9 percent from September 2007. Revenues for January through September 2008 totaled NT$260,941 million, an increase of 17.2 percent compared to the same period in 2007.
On a consolidated basis, net sales for September 2008 were NT$29,315 million, a decrease of 8.0 percent from August 2008 and a decrease of 0.5 percent from September 2007. Revenues for January through September 2008 totaled NT$268,595 million, an increase of 17.4 percent compared to the same period in 2007.
On a consolidated basis, net sales for September 2008 were NT$29,315 million, a decrease of 8.0 percent from August 2008 and a decrease of 0.5 percent from September 2007. Revenues for January through September 2008 totaled NT$268,595 million, an increase of 17.4 percent compared to the same period in 2007.
|
||||||
Related News
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |