TranSwitch to Present Industry Leading HDMI / DisplayPort Solutions at SoCIP 2008 Conference in Beijing and Shanghai
SHELTON, CT – October 13, 2008 – TranSwitch® Corporation (NASDAQ: TXCC), a leading provider of carrier-class semiconductor solutions for the converging voice, data and video network will be a featured exhibitor and presenter at the SoCIP 2008 conference and exhibition to be held in Beijing and Shanghai on October 13th and 15th respectively. SoCIP targets the fast growing semiconductor market in China, bringing together system-on-a-chip (SoC) designers/professionals, intellectual property suppliers and SoC solution vendors.
The TranSwitch booth at SoCIP will feature live demonstrations of the HD-PXL-1.3 technology operating on the company’s flexible development platform. Conference attendees will have the opportunity to witness the superior performance characteristics of the technology under real-world conditions using state-of-the-art advanced HDMI test equipment.
TranSwitch, a featured presenter at the SoCIP seminar, will unveil HDP - its next generation PHY technology. HDP is a unified solution, simultaneously addressing both HDMI and DisplayPort applications.
In April, TranSwitch introduced its family of HD-PXL-1.3 HDMI IP cores, the industry’s first IP cores capable of 10.5 Gbps speeds. Using proprietary Digital Signal Processing (DSP) technology, these cores achieve industry leading performance, running at aggregated speeds of up to 10.5 Gbps and supporting color depths of up to 16 bits, while providing low power consumption and small die size.
The TranSwitch PHY cores incorporate a number of unique features that enhance signal integrity and provide a high degree of control over various signal parameters, enabling robust, error-free video transmission over a wide spectrum of cables, connectors, and speeds.
TranSwitch provides a comprehensive package of deliverables to assist customers through all phases of development, design integration and manufacturing of their SoC. This package includes a development platform, as well as all documentation and models of the IP, which allows customers to easily integrate the HD-PXL-1.3 IP cores into complex SoC designs so they can get to market more quickly.
|
Related News
- TranSwitch to Demonstrate the Industry's Most Advanced IP Core Solutions for High Definition Video at 2011 International CES
- USB, MIPI, Ethernet, DisplayPort, PCIe, DDR, HDMI, ONFi Analog Phy IP Cores silicon proven in UMC 28nm & UMC 40nm Process
- Chips&Media to Present the Latest Video Solutions at SoCIP2010 Symposium in Shanghai, Beijing
- TranSwitch Announces a Technology License Agreement for Its 3.5G HDMI 1.3 PHY IP Core
- TranSwitch announces first HDMI 1.3 PHY IP Core operating at 10.5 Gbps
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |