Sonics OCP Library for Verification Now Shipping
MILPITAS, Calif. -- October 23, 2008 -- Sonics Inc., a premier supplier of system-on-chip (SoC) SMART Interconnect solutions, today announced the general availability of the Sonics OCP Library for Verification (SOLV). Core designers are using the SOLV package for debugging, performance tuning and validation of complex intellectual property (IP) cores using OCP interfaces.
The SOLV package includes Sonics SVA OCP Checker, OCP disassembler (ocpdis2) and OCP performance analyzer (ocpperf2). Together, this suite of tools enable validation of OCP socket interfaces and the analysis of their performance.
The Sonics SVA OCP Checker validates OCP sockets for protocol compliance during simulation and generates OCP trace files for use by post-processing tools. The tool enables users to quickly and efficiently identify OCP protocol violations at each socket. Full OCP protocol compliance checking ensures that the macro blocks interconnected are free from communication defects. The checker supports the full set of protocol compliance checks as defined by the OCP-IP community.
The OCP disassembler (ocpdis2) allows the display of OCP connection activity in a convenient, readable, report format. The data captured during simulation can be used to understand traffic conditions in the design.
The ocpperf2 processes ocpdis2-produced trace files to measure the performance of OCP transfers and burst transactions. Using this information, a designer can individually tune OCP socket performance to balance the on-chip traffic for any given application.
“Sonics is committed to helping our customers improve the quality and performance of their designs,” said Ray Brinks, vice president of engineering at Sonics, Inc. “SOLV addresses universal needs of core designers. We are seeing a large interest in this package across vertical industries.”
“The issues and challenges surrounding verification in multicore design are many, and from its inception OCP has been designed and evolved to ease some of these challenges,” said Ian Mackintosh president and chairman of OCP-IP. “We are extremely pleased to see Sonics leverage its extensive expertise to assist OCP users increasing the quality and performance of their designs.”
About Sonics
Sonics Inc. supplies critical semiconductor intellectual property for SoCs. Its customers see the benefits of high design predictability and increased design efficiency. Sonics solutions address the growing complexity found in consumer products with voice, data and video features. Major semiconductor and systems companies including Broadcom, Samsung, Texas Instruments and Toshiba leverage Sonics’ technology in leading products in the wireless, digital multimedia and communications markets. For more information, see www.sonicsinc.com.
|
Related News
- Verification Library Accelerates OCP System Designs
- OCP-IP Announces Availability of Mentor Graphics CheckerWare Library of Verification IP
- Qualis and Sonics Partnership Produces OCP-Compliant Domain Verification Component
- Siemens delivers AI- accelerated verification for analog, mixed-signal, RF, memory, library IP and 3D IC designs in Solido Simulation Suite
- Imperas releases new updates, test suites, and functional coverage library to support the rapid growth in RISC-V Verification
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |