MEMSCAP Steps into Nanoworld
GRENOBLE, France & DURHAM, N.C. -- December 8, 2008 -- MEMSCAP (Paris:MEMS - News), the leading provider of innovative solutions based on MEMS (micro-electro-mechanical systems) technology, announced today it has stepped into the Nanoworld by offerring a breakthrough Nano-plaftorm with its MUMPs® manufacturing and prototyping services.
Based on MUMPs® proven manufacturing techniques, the new Nano MUMPs® platform will create submicron features on MUMPs® polysilicon wafers. This represents a breakthrough technology as it is the first time such a manufacturing and prototyping service is offered on the nanoscale (below 1µ) for mechanical structures.
Taking place alongside the existing others runs (Poly MUMPs®, SOI MUMPs®, Metal MUMPs®) , Nano MUMPs® will immediately benefit from the over 16 years experience of MUMPs® and its track-record of success that led to more than half a million MEMS devices shipped to over 1000 customers. The expertise gained with other runs will also enable to keep the same process length, allocate more space for devices on each run, give customers the possibility to compare the advantages of micro and nano processes before going to volume manufacture, and mostly, offer customers the most cost-effective manufacturing and prototyping services for nanomachines.
The applications for this new process are endless, from mirors to fuel cells, through fluidics, renewable energies, accelerometers and medical/biomedical applications.
MUMPs® is the ultimate platform for proof-of-concept fabrication. The longest running and most renowned multi-user program for MEMS and now NANO technologies, manufacturing in the world, MUMPs® uses standard yet diversified process technologies that serve universities, laboratories, companies and researchers. Its versatile possibilities adapt to endless features, devices, and applications. The service’s low cost allows researchers with the smallest budgets to realize their ideas.
About MEMSCAP
MEMSCAP is the leading provider of innovative micro-electro-mechanical systems (MEMS)-based solutions. MEMSCAP standard and custom products and solutions include components, component designs (IP), manufacturing and related services. MEMSCAP customers include Fortune 500 businesses, major research institutes and universities. The company's shares are traded on the Eurolist of Euronext Paris S.A (ISIN: FR0010298620-MEMS), where MEMSCAP belongs to the Next Economy segment. More information on the company's products and services can be obtained at www.memscap.com.
About MUMPs®
The Multi User MEMS Processes, or MUMPs®, is the longest-running MEMS prototyping service in the industry, and the defacto standard process to support academic, government, and industrial research in MEMS. Fabricated out of the Research Triangle Park, North Carolina facility for fourteen years, the MUMPs® prototyping service has been operated by listed company MEMSCAP since November 2002. Originally developed as part of a MEMS infrastructure program, MUMPs has expanded over the years from one to four distinct multiple mask-level processes, adding thick metal, SOI, and CMOS-MEMS process to the polysilicon surface micromachining process. Nearly half a million MEMS devices have been shipped to over 1000 customers over the life of the MUMPs program. Visit www.memscap.com section MUMPs.
|
Related News
- Sondrel CEO steps down as chip firm faces re-organization
- Codasip steps up its focus on Europe and appoints Till-Vattier as EMEA VP
- Sondrel explains the 10 steps to model and design a complex SoC
- Nvidia Abandons Arm Deal, Segars Steps Aside for IPO
- Andes Technology Steps Up to Premier Membership in RISC-V International; Greatly Expanding its U.S. R&D and Field Application Engineering Staffing
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |