2D Vector Graphics Accelerator / GPU (Graphics Processing Unit)
Cadence Low-Power Solution Enables Fujitsu Microelectronics Tapeout of 65nm WiMAX Design
SAN JOSE, Calif. -- Jan 12, 2009 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global design innovation, announced today that Fujitsu Microelectronics Limited has taped out a 65nm mobile WiMAX design using Fujitsu Reference Design Flow 3.0, which includes Common Power Format (CPF) enabled Cadence® Low-Power technologies. The use of these technologies enabled Fujitsu Microelectronics to reduce leakage power by 88 percent and reduce overall power consumption by 36 percent.
“The CPF-enabled Cadence Low-Power Solution allowed us to raise the bar on low-power design, with more power saving and reduced turnaround time,” said Nobuhiko Aneha, deputy general manager of the mobile solution division of Fujitsu Microelectronics Ltd. “This is a proven solution for us, and we will continue to deploy it for other low-power designs.”
The development, first unveiled by Fujitsu Microelectronics at the Cadence DA SHOW/CDNLive! conference in Japan, demonstrates that the Cadence Low-Power Solution continues to gain momentum as an essential production-quality, robust low-power design solution backed by real design tapeouts.
A number of technologies in the Cadence Low-Power Solution were responsible for the result. The automated power shut-off flow in Encounter digital implementation helped Fujitsu Microelectronics achieve about 50 percent reduction in physical design turnaround time compared to previous methodologies. The CPF-based Incisive® Simulation technology allowed Fujitsu Microelectronics to run logic simulation of the power shutoff feature without requiring custom programming language interfaces (PLIs). The Cadence Conformal® Low-Power software verified the low-power design rules through structural and functional verification, while both Incisive and Conformal low-power verification technologies contributed to the improved quality of silicon for this design.
“Since inception, the CPF-enabled Cadence Low-Power Solution has gained recognition in the industry for being able to deliver on real production designs,” said Dave Desharnais, group director of IC Digital products at Cadence. “Cadence is delighted to be part of Fujitsu Microelectronics’ recent successful design tapeout, and will continue to support Fujitsu Microelectronics in its low-power design methodology.”
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software and hardware, methodologies, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
|
Cadence Hot IP
Related News
- Sequans Speeds Tapeout of 65-Nanometer Mobile WiMAX Single Die Baseband Chip with Cadence Low-Power Solution
- Cadence Joules RTL Power Solution Enables Socionext to Accelerate Low-Power HEVC 4K/60p Video Codec Chip Development
- Sidense OTP for Low-Power 90nm Implementation Selected by Fujitsu Microelectronics
- Cadence Collaborates with UMC to Deliver 65nm CPF-Based Low-Power Reference Design Flow
- Imagination Optimizes PPA and Speeds the Delivery of Low-Power GPUs Using AI-Driven Cadence Cerebrus in the OnCloud Platform
Breaking News
- VeriSilicon introduces AcuityPercept: an AI-powered automatic ISP tuning system
- Avant Technology Partners with COSEDA Technologies to Enhance System-Level Software Solutions
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Sarcina Technology launches AI platform to enable cost-effective customizable AI packaging solutions
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |