Redpine Signals Releases Industry's First 802.11n Serial to Wi-Fi Solution for Machine to Machine (M2M) Communications
San Jose, CA — Jan. 20, 2009 — Redpine Signals, Inc., a leading developer of ultra low power multi-standard OFDM and MIMO silicon-based solutions for Wi-Fi®, WiMAX® & LTE, today announced the availability of a pair of serial wireless device server modules based on its ultra low-power Lite-Fi™ 802.11n technology. The modules provide industrial devices and other equipment with advanced wireless connectivity to local-area networks, enabling communication with the devices from servers anywhere on the local network or on the internet without the need to install wireless networking software or a network stack.
The modules offer complete functionality of a device server including the processing system with its networking stack and an 802.11n sub-system with communication, configuration, and control functions, a frequency reference, and an integrated antenna, along with a simple AT command interface for module configuration. The modules integrate the Lite-Fi™ RS9110 chipset, a highly integrated 802.11n SoC, an RF transceiver, power amplifier, EEPROM and external front-end components. The RS9110 SoC integrates a proprietary multi-threaded processor on which the WLAN protocol, configuration, power-save modes, operating system, network stack, and application functions are implemented. The modules provide outstanding ease of integration at low system cost, featuring a single 3.3V power supply, and the software to establish and terminate wireless connections.
The modules include the RS9110-N-11-21 and the RS9110-N-11-22 that operate in the 2.4GHz ISM band and have interfaces to coexist with other radios, such as Bluetooth, in the same band. The -22 module is a fully integrated device server with a complete TCP/IP networking stack, web server, WLAN driver, 802.11 enterprise security, and WLAN protocol running on the internal processor. It provides complete LAN and internet connectivity to equipment with a serial interface, and is ideal for M2M communications. The -21 module is a low cost device that provides secure WLAN connectivity to equipment or host systems that are connected to a network through a serial interface running SLIP. The -21 module originates or terminates SLIP connections, and provides connectivity to remote networks through the WLAN protocol. Both devices provide for termination of UDP connections and enable the collection, packetization, and transfer of external data from sensors or other special purpose devices connected via GPIO lines. The size of the modules is 35mm x 23mm and they support industrial grade temperatures (-40C to +85C). Apart from industrial equipment, POS systems, medical equipment, telemetry solutions, parking and utility meters, surveillance equipment, digital picture frames, and a host of other systems would benefit from these modules.
"Enterprise wireless networks are steadily moving towards widespread use of the 802.11n standard, with its attendant improvement in efficiency of spectrum use, higher user data rates, and longer range of operation. Preserving the capacity of an 802.11n network requires all clients, irrespective of their bandwidth needs, to use the 802.11n protocol. Our device server modules address precisely this need – providing a large variety of equipment with low-cost, single-stream 802.11n based network connectivity, with little or no integration effort," said Venkat Mattela, CEO of Redpine Signals. "These modules are based on our proven and highly integrated RS9110 SoC, which is the industry’s first single-stream solution to be Wi-Fi certified for the 802.11n draft 2.0 certification. The need for automation and flexibility of equipment deployment at low cost was never more needed than now in the industrial market, and the RS9110-N-11-21 and RS9110-N-11-22 modules are unique solutions in this fast growing market segment," he added.
About Redpine Signals, Inc.
Founded in 2001, Redpine Signals is a wireless semiconductor company driving Wi-Fi® +WiMAX® + 3GPP LTE convergence products for mobile, industrial, consumer and enterprise applications with sustainable differentiation in power and performance. Using its extensive patent portfolio in ultra low power OFDM and MIMO technologies, Redpine is making wireless convergence a reality.
Redpine is headquartered in San Jose, California with a development center in Hyderabad, India. For more information, visit www.redpinesignals.com.
|
Related News
- Redpine Signals' Lite-Fi(TM) 802.11n SoC is Among the First Devices Certified by the Wi-Fi Alliance(R) for Voice-Over-Wi-Fi(R) Applications
- Atmel and Redpine Signals Collaborate to Provide Ultra-Low-Power 802.11n Wi-Fi Capability for AVR and ARM-based Microcontrollers
- Cypress and Redpine Signals Collaborate to Provide Low-Power 802.11n Wi-Fi® I/O Connectivity for PSoC® 3 and PSoC 5 Platforms
- Newport Media Introduces World's Smallest, Lowest Power 802.11n Wi-Fi SoC
- Ittiam's Wi-Fi IP Gets Strong Traction in Consumer Markets with Multi-million Units Production
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |