Tensilica's Diamond Standard 330HiFi Audio DSP Licensed by Fujitsu Microelectronics for Portable Consumer Electronics
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
SANTA CLARA, Calif. USA – January 27, 2009 – Tensilica, Inc. today announced that its Diamond Standard 330HiFi Audio DSP (digital signal processor) has been licensed by Fujitsu Microelectronics Limited for use in a customer’s portable consumer electronics design.
“We selected Tensilica’s Diamond Standard 330HiFi Audio DSP for our customer’s portable consumer product,” stated Yoshio Kuniyasu, general manager of the IP Platform Solution Division at Fujitsu Microelectronics Limited. “Our customer realized that the Tensilica solution is one of the best for low power and had an extensive list of available software.”
“We’re very happy to work with Fujitsu Microelectronics as they develop this ASIC for their customer,” stated Steve Roddy, Tensilica’s vice president of marketing and business development. “Fujitsu Microelectronics has outstanding ASIC engineers and production capabilities and should be able to bring this high-volume product into full production very quickly.”
About TensilicaTensilica, Inc., is the recognized leader in customizable dataplane processors. Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica's application specific processor cores enable rapid customization to meet specific data-plane performance targets. Tensilica's DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented benchmark-proven DPUs visit www.tensilica.com .
|
Related News
- Samsung Signs Multi-Year License for Tensilica Diamond Standard 330HiFi Audio DSP
- Penstar Technology Licenses Tensilica's Diamond Standard 330HiFi Audio Processor Core for AVS Standard in China
- LG Electronics Licenses Tensilica's Diamond Standard 330HiFi
- Tensilica Announces Diamond Standard 330HiFi, a Low-Power 24-bit Audio DSP
- MegaChips Selects Tensilica's HiFi Audio/Voice DSP for Consumer Products Designs
Breaking News
- JEDEC Publishes LPDDR5 CAMM2 Connector Performance Standard
- Alphawave Semi Selected for AI Innovation Research Grant from UK Government's Advanced Research + Invention Agency
- Weebit Nano continuing to make progress with potential customers and qualifying its technology Moving closer to finalisation of licensing agreements Q1 FY25 Quarterly Activities Report
- PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC
- Secure-IC obtains the first worldwide CAVP Certification of Post-Quantum Cryptography algorithms, tested by SERMA Safety & Security
Most Popular
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
- Xiphera and Crypto Quantique Announce Partnership for Quantum-Resilient Hardware Trust Engines
- Arm's power play will backfire
- Alchip Announces Successful 2nm Test Chip Tapeout
- Faraday Unveils HiSpeedKit™-HS Platform for High-speed Interface IP Verification in SoCs
E-mail This Article | Printer-Friendly Page |