UpZide Becomes Tensilica Authorized Software Design Center; Offers Expertise in VDSL2, LTE, UWB and Baseband Chip Design
Update: Cadence Completes Acquisition of Tensilica (Apr 24, 2013)
Luleå, Sweden, and SANTA CLARA, Calif. USA – January 28, 2009 – Tensilica, Inc. today announced that UpZide Technologies AB is now an authorized Tensilica Software Design Center. Over the past three years, UpZide has worked extensively on designs with Tensilica’s Xtensa® customizable processors, and have strong expertise in optimizing these processors for VDSL2 (very high bit rate digital subscriber line), the most advanced standard for DSL communications. UpZide is now available to help other companies with their wireless datapath or baseband designs, including LTE (long-term evolution) and UWB (ultra wideband).
“We have extensive expertise in optimizing Xtensa processors for performance improvements that are orders of magnitude beyond the reach of conventional processor cores for demanding dataplane tasks such as VDSL2,” stated UpZide’s CEO, Dr. Mikael Isaksson. “For example, a critical part of the VDSL2 design is the FFT/IFFT unit. We evaluated a top-of-the-line DSP, which showed us that each 4K transform would need approximately 370 microseconds to execute at 200 MHz clock frequency, even with highly optimized code. This is too slow for VDSL2. Using Tensilica’s technology, each 4K transform needs less than 80 microseconds to execute at 200MHz - a significant improvement that meets the VDSL2 specifications.”
“UpZide has deep expertise in designing state-of-the-art datapaths with Tensilica’s technology,” stated Chris Jones, Tensilica’s director of strategic alliances. “UpZide has proven that they can optimize our processors for complex communications algorithms, and we are excited to add them to our list of authorized software design centers.”
About UpZide
UpZide Technologies AB offers design services to companies who are designing integrated circuits for complex communications tasks, including VDSL2, UWB, and LTE. UpZide has considerable expertise in developing low-power, programmable solutions based on Tensilica’s customizable Xtensa processor cores. For more information, see www.upzide.com.
About Tensilica
Tensilica, Inc., is the recognized leader in customizable dataplane processors. Dataplane Processor Units (DPUs) consist of performance intensive DSP (audio, video, imaging, and baseband signal processing) and embedded RISC processing functions (security, networking, and deeply embedded control). The automated design tools behind all of Tensilica's application specific processor cores enable rapid customization to meet specific data-plane performance targets. Tensilica's DSPs and processors power top tier semiconductor companies, innovative start-ups, and system OEMs for high-volume products including mobile phones, consumer electronics devices (including portable media players, digital TV, and broadband set top boxes), computers, and storage, networking and communications equipment. For more information on Tensilica's patented benchmark-proven DPUs visit www.tensilica.com .
|
Related News
- Rhonda Becomes Tensilica's First Authorized Software Design Center
- Fraunhofer IIS Becomes Tensilica Authorized Design Center Partner
- KPIT Cummins becomes Authorized Tensilica System-on-Chip (SoC) Design Center
- Calsoft Becomes Tensilica Software Design Center, Supporting Next-Generation Video/Audio and Security Oriented Application Designs
- MegaChips Becomes Tensilica Authorized Design Center
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |