Rambus Implements XDR Memory Interface in Ultra Low-Cost Package
DesignCon, San Jose, California, United States - February 3, 2009 -- Rambus Inc. (Nasdaq:RMBS), one of the world's premier technology licensing companies specializing in high-speed memory architectures, today announces the implementation of its award-winning XDR™ memory architecture using an ultra low-cost LQFP package. In a paper to be presented at DesignCon, Rambus will discuss the benefits of differential signaling delivering high memory bandwidth in a cost-effective package, ideal for consumer electronics such as set-top boxes and HDTVs.
“Today’s consumer electronics require high bandwidth and low-cost manufacturability,” said Martin Scott, senior vice president of Research and Technology Development at Rambus. “Our team has demonstrated that the superior signal integrity of the XDR memory architecture, which enables the highest data rates of any DRAM technology, also makes possible high-speed operation in very low-cost device packaging.”
To showcase the capability of its XDR memory architecture to operate at multi-gigabit data rates in an ultra low-cost package, Rambus has implemented an XDR memory controller in an LQFP package that can operate reliably at data rates of up to 3.2Gbps. Rambus will demonstrate this achievement at DesignCon (booth #205). The paper titled, Feasibility of Multi-Gigabit Memory Interface in LQFP Packages, will be presented at DesignCon on February 4, 2009 and will be available on www.rambus.com.
About Rambus Inc.
Rambus is one of the world's premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company's patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus' innovations and solutions enable unprecedented performance in computing, communications, and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as a range of leadership and industry-standard memory solutions. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, and Taiwan. Additional information is available at www.rambus.com.
|
Related News
- Uniquify to Present High-Performance DDR3 Memory System in Low-Cost Wire Bond Package, Fastest DDR4 Memory IP at CSIA-ICCAD 2014 in Hong Kong
- Uniquify Delivers High-Performance DDR3 Memory System Running in Low-Cost, Wire Bond Package
- Toshiba Licenses Rambus XDR Memory and PCI Express Interface Solutions
- Teradici Selects Rambus XDR Memory Interface
- Rambus Unveils Next Generation XDR Memory Interface
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |