English
Rumor mill: UMC to join IBM 'fab club'?
Mark LaPedus, EE Times
(02/11/2009 12:49 PM EST)
SAN FRANCISCO -- Rumors at ISSCC and other events are that Taiwan foundry vendor United Microelectronics Corp. (UMC) is mulling over plans to join IBM's ''fab club.''
At present, UMC is developing leading-edge process technology by itself. This is a costly effort--even for Intel.
UMC has a 45-/40-nm process, but can it do 32-nm and beyond? It can barely keep up with rival TSMC.
To help its efforts, UMC recently joined Sematech. But UMC is also looking to join IBM's technology platform alliance, sources said.
(02/11/2009 12:49 PM EST)
SAN FRANCISCO -- Rumors at ISSCC and other events are that Taiwan foundry vendor United Microelectronics Corp. (UMC) is mulling over plans to join IBM's ''fab club.''
At present, UMC is developing leading-edge process technology by itself. This is a costly effort--even for Intel.
UMC has a 45-/40-nm process, but can it do 32-nm and beyond? It can barely keep up with rival TSMC.
To help its efforts, UMC recently joined Sematech. But UMC is also looking to join IBM's technology platform alliance, sources said.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards