Rapid Bridge announces Value and Innovate Pricing Plans
Qualcomm to Acquire the Assets of Semiconductor Design Innovator Rapid Bridge (June 10, 2011)
San Diego California -- March 17, 2009 -- Rapid Bridge LLC, a premier provider of IP, today announced two new plans to meet the needs of SoC customers:-
The Value Plan — Enables our customers to use our entire IP portfolio (IOs, USB 2.0/3.0, DDR2/3, SerDes, etc.) for a fixed fee, offering great value. The value plan reduces your IP bill; for example, the IP bill for an SoC chip utilizing DDR2, USB2.0 and SerDes is ~$750K. The Value Plan offers the same combination, plus the additional IPs needed for tape-out at a price that is far below the $700K mark.
-
The Innovate Plan — In the spirit of partnership and to encourage innovation, this plan offers our customers the option to only pay 50% of the IP fees at engagement time, and the remainder when they go to production.
“As far as I know, the Innovate Plan remains unique; there is nothing else out there like it (that I know of), so it is exciting for us and for our customer during the current times”.
“Our broader aim is to lower barriers of entry and unleash innovations. I think we have achieved this with our new pricing plans. Both Value and Innovate plans create tremendous value for our customers,” said Randy Wayland, Rapid Bridge’s Technical Marketing Director.
About Rapid Bridge LLC
Rapid Bridge is a privately-held corporation providing solutions at 65 nm, 90 nm and beyond. The company has developed a patented chip-level approach to IC development that dramatically outperforms the industry on speed, area and power. For additional information, please contact Alex Mazloom at Rapid Bridge or refer to our website: http://www.rapidbridge.com
|
Related News
- Qualcomm to Acquire the Assets of Semiconductor Design Innovator Rapid Bridge
- Rapid Bridge Enters into Distribution Agreement with Cadence
- Rapid Bridge Acquires QThink IC Design
- Rapid Bridge Tapes Out World's Smallest USB 2.0/3.0 PHY
- Rapid Bridge Technology Selected by AppliedMicro for Multi-Platform Advanced Nanometer System-on-Chip Development
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |