Rapid Bridge announces Value and Innovate Pricing Plans
Qualcomm to Acquire the Assets of Semiconductor Design Innovator Rapid Bridge (June 10, 2011)
San Diego California -- March 17, 2009 -- Rapid Bridge LLC, a premier provider of IP, today announced two new plans to meet the needs of SoC customers:-
The Value Plan — Enables our customers to use our entire IP portfolio (IOs, USB 2.0/3.0, DDR2/3, SerDes, etc.) for a fixed fee, offering great value. The value plan reduces your IP bill; for example, the IP bill for an SoC chip utilizing DDR2, USB2.0 and SerDes is ~$750K. The Value Plan offers the same combination, plus the additional IPs needed for tape-out at a price that is far below the $700K mark.
-
The Innovate Plan — In the spirit of partnership and to encourage innovation, this plan offers our customers the option to only pay 50% of the IP fees at engagement time, and the remainder when they go to production.
“As far as I know, the Innovate Plan remains unique; there is nothing else out there like it (that I know of), so it is exciting for us and for our customer during the current times”.
“Our broader aim is to lower barriers of entry and unleash innovations. I think we have achieved this with our new pricing plans. Both Value and Innovate plans create tremendous value for our customers,” said Randy Wayland, Rapid Bridge’s Technical Marketing Director.
About Rapid Bridge LLC
Rapid Bridge is a privately-held corporation providing solutions at 65 nm, 90 nm and beyond. The company has developed a patented chip-level approach to IC development that dramatically outperforms the industry on speed, area and power. For additional information, please contact Alex Mazloom at Rapid Bridge or refer to our website: http://www.rapidbridge.com
|
Related News
- Qualcomm to Acquire the Assets of Semiconductor Design Innovator Rapid Bridge
- Rapid Bridge Enters into Distribution Agreement with Cadence
- Rapid Bridge Acquires QThink IC Design
- Rapid Bridge Tapes Out World's Smallest USB 2.0/3.0 PHY
- Rapid Bridge Technology Selected by AppliedMicro for Multi-Platform Advanced Nanometer System-on-Chip Development
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |