Broadcom Announces Industry's First 65nm All-DSP, Dual PHY Solutions for 10GbE SFP+ Applications
New Devices Enable Low Cost and Power Upgrade Path for Higher Density Enterprise 10GbE SFP+ Systems
SAN DIEGO, March 23, 2009 -- OFC 2009 -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced two new low power, dual 10 Gigabit Ethernet (10GbE) physical layer (PHY) devices that leverage Broadcom's field proven digital signal processing (DSP) technology. These are the industry's first 65 nanometer (nm) CMOS all-DSP 10GbE serial transceivers that enable IT professionals to preserve existing fiber infrastructures by providing a low cost upgrade path from 1 Gigabit Ethernet (1GbE) to 10GbE. The unique Broadcom® high-speed DSP technology provides significant performance, manufacturing and reliability advantages over competing analog solutions that will drive the transition to 10GbE by leveraging the cost effective SFP+ standard.
Today's networking equipment, such as high-end routers, network aggregation switches, blade servers and top-of-rack data center switches, require increased densities to address next generation bandwidth and throughput needs of the enterprise. Port counts can vary from 8 to 16 10GbE channels, to as many as 48 channels on next generation 10GbE blade server or enterprise chassis systems. To enable the introduction of these high port count systems, low cost module solutions, such as SFP+ with support for both fiber and direct attached copper interfaces, are starting to ship in volume today.
Broadcom is uniquely positioned to address the needs of the high density SFP+ market with its new BCM8727 dual 10GbE SFI-to-XAUI PHY and BCM8750 dual 10GbE SFI-to-XFI PHY solutions. Both solutions exceed the requirements of the IEEE 802.3aq standard, which was developed to provide a low cost 10x speed upgrade for existing Gigabit Ethernet links in multi-mode fiber applications. By utilizing a PHY based entirely on DSP architecture, enterprise data centers can now achieve higher bandwidth and performance, while maintaining significant savings in cost, resources and manpower when upgrading to 10GbE links.
"We're seeing the demand for network bandwidth growing in every market segment, from consumer to enterprise to service/content providers. As 10GbE technology becomes more cost effective, and with the adoption of newer technologies such as SFP+, we are well positioned to expand our market leadership by leveraging our broad and field proven Ethernet product portfolio and superior technology," said Lorenzo Longo, Vice President & General Manager for Broadcom's High Speed Interconnect Products line of business. "Our new BCM8727 and BCM8750 10GbE PHYs were developed in 65nm CMOS and are the optimal solutions for our customers combining the highest performing DSP technology with low power dissipation."
Technical Information
The Broadcom BCM8727 dual 10GbE SFI-to-XAUI PHY and the BCM8750 dual 10GbE SFI-to-XFI PHY build upon six generations of field proven 10GbE serial PHY technology. Both implement Broadcom's electronic dispersion compensation (EDC) equalizer technology that uses an all-DSP design, resulting in maximum flexibility with the highest performance, exceeding the IEEE 10GBASE-LRM Pre, Post, and Split Symmetric Stressors and up to 15 meters of low-cost direct attached copper SFP+. An on-chip micro-controller provides additional flexibility to maintain optimal performance in even the most challenging operating conditions.
In support of the SFP+ optical module standard, the devices incorporate multi-tap transmit pre-emphasis to compensate for FR-4 board material loss in line card applications. For additional flexibility, they support backward compatibility using existing 1GbE SFP modules, providing a single PHY design that is capable of interfacing to both new and legacy Ethernet interfaces from a single PCB design.
Industry's Most Comprehensive 10 Gigabit PHY Portfolio
The new BCM8727 and BCM8750 further Broadcom's position as the only silicon provider in the industry with a complete line of 10 Gigabit (10G) PHY products supporting backplane, twisted pair and optical front panel applications. This comprehensive product portfolio includes support for all 10G PHY standards including 10GBASE-T, 10GBASE-KR, 10GBASE-LRM, 10GBASE-SR/LR and 10GBASE-ER/ZR.
The new 10GbE dual PHYs are designed using a 65 nanometer process--the most advanced lithographic node for manufacturing semiconductors in large volumes today--that provides significant benefits over 90nm and 130nm processes by enabling lower power consumption, smaller size and higher levels of integration.
Broadcom's complete end-to-end Ethernet networking product portfolio includes switching products, transceivers, security processors and high-speed controllers for servers, workstations, desktops and mobile PCs, providing the industry's most comprehensive portfolio of Ethernet networking solutions, and the most widely deployed and field proven in the industry.
Availability and Pricing
The BCM8727 and BCM8750 10GbE PHYs are currently sampling to customers. The BCM8727 is available in a 19mm x 19mm, BGA, RoHS-compliant package while the BCM8750 is available in a 12mm x 12mm, BGA, RoHS-compliant package. Pricing is available upon request.
About Broadcom's Enterprise Networking Group
Broadcom designs and develops complete silicon and software solutions for service provider, data center, enterprise and small-to-medium business (SMB) networks. Our solutions leverage industry-proven Ethernet technology to promote faster, greener and more cost-efficient transport and processing of voice, video and data across both wired and wireless networks. Broadcom's technology enables a network infrastructure that is scalable, secure and easy to manage. Our products are found in a wide variety of networking equipment including Ethernet switches, routers and gateways, security appliances, DSLAMs, 3G/4G wireless backhaul equipment, cable and VoIP hardware, desktop and notebook computers, servers and storage appliances, and network-attached printers.
About Broadcom
Broadcom Corporation is a major technology innovator and global leader in semiconductors for wired and wireless communications. Broadcom products enable the delivery of voice, video, data and multimedia to and throughout the home, the office and the mobile environment. We provide the industry's broadest portfolio of state-of-the-art system-on-a-chip and software solutions to manufacturers of computing and networking equipment, digital entertainment and broadband access products, and mobile devices. These solutions support our core mission: Connecting everything®.
Broadcom is one of the world's largest fabless semiconductor companies, with 2008 revenue of $4.66 billion, and holds over 3,100 U.S. and over 1,400 foreign patents, more than 7,600 additional pending patent applications, and one of the broadest intellectual property portfolios addressing both wired and wireless transmission of voice, video, data and multimedia.
Broadcom is headquartered in Irvine, Calif., and has offices and research facilities in North America, Asia and Europe. Broadcom may be contacted at +1.949.926.5000 or at www.broadcom.com.
|
Related News
- Faraday Unveils Enhanced Gigabit Ethernet PHY on UMC's 28HPC+ Process
- Broadcom Announces Industry's First Silicon-Proven 7nm IP for ASICs in Deep Learning and Networking Applications
- PLDA and M31 Announce a Compliant PCI Express 3.0 Solution Including PLDA's XpressRICH3 Controller and M31's PHY IP for the TSMC 28HPC+ Process Node at 8 GT/s
- Broadcom Introduces Industry's First 40GbE Quad Port Gearbox PHY
- Broadcom Enables Industry's First 20 nm 100G Coherent PHY
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |