Another ARC makeover begins as Schlachte departs
(05/07/2009 6:43 PM EDT)
URL: http://www.eetimes.com/showArticle.jhtml?articleID=217300766
MANHASSET, NY — The stock of ARC International shot up by 42 percent to 14.20p on the London Stock Exchange Thursday (May 7th), the day after the company announced the resignation of its former CEO Carl Schlachte.
Evidently, the financial market liked what it saw in the management change.
Lee Simpson, equity analyst at Jefferies International Ltd., wrote that the "CEO departure means much may change...a potentially tighter reliance on audio and a turnaround focus (cost base, execution, royalties) may only be the start."
Clearly, the survival of ARC remains in precarious balance, as new CEO Geoff Bristow seeks ways to bring ARC back to profitability.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- CEO interview: with ARC's Carl Schlachte
- ARC CEO, Carl Schlachte: Configurable micros bring a revolution
- Flexibility key to profitability (by Carl Schlachte, CEO, ARC International)
- Synopsys Advances Automotive Security with Industry's First IP Product to Achieve Third-Party Certification for ISO/SAE 21434 Cybersecurity Compliance
- BrainChip Begins Accepting Pre-Orders of the Akida Edge AI Box
Breaking News
- Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
- Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
- Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration
- MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
Most Popular
- New Breakthroughs in China's RISC-V Chip Industry
- Cadence to Acquire Arm Artisan Foundation IP Business
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- Shifting Sands in Silicon by Global Supply Chains